本論文利用RF磁控濺鍍系統與高溫爐熱退火架構去研製銻之摻雜氧化鋅(SZO)薄膜。薄膜之晶體結構與電性分別利用X-Ray繞射儀、SEM、AFM與霍爾量測儀器去量測。從XRD分析中發現,隨著摻雜濃度的提升, (002) PEAK會向低角度位移;而從霍爾量測分析中顯示,在溫度550℃濺鍍,接著於充滿氮氣的環境中以850℃退火10分鐘,可使濃度1.0at.% SZO薄膜形成p型半導體。此時電阻率、載子濃度與遷移率分別為2.19(Ω-cm)、5.62×1017(cm-3)、5.06(cm2/Vs)。因此,本實驗利用RF磁控濺鍍系統製作摻雜銻之氧化鋅薄膜,成功摻雜出具有良好電性、高載子濃度以及均勻性相當好的P行半導體薄膜。
We investigated the Sb-doping effects on ZnO thin films using RF (radio frequency) magnetron sputtering and post thermal annealing. The structural and electronic properties of the thin films were measured by X-ray diffraction, SEM (scanning electron microscope), Hall effect measurement, and AFM. Results of X-ray diffraction reveal that the Sb atoms were successfully occupied the zinc sites, and made the (002) peak shift to lower angle value. The Hall effect measurement shows that the 1% Sb-doped films deposited at temperature of 550℃, and annealed for 10 min at 850℃ and in the N2 atmosphere were p-type semiconductor. The films showed a resistivity of 2.19(Ω-cm), hole concentration of 5.62×1017(cm-3), and mobility of 5.06(cm2/Vs). In this study, the Sb-doped p-type ZnO thin films were successfully grown by RF magnetron sputtering with high carrier concentration, low resistivity, and low roughness.