應用系統封裝技術於射頻前端模組之研製

Design and Fabrication of RF Frond-end Module using System-in-Package Technology

李威弦(Wei-Hsuan Lee)

指導教授 ： 黃建彰

元智大學/工程學院/通訊工程學系/碩士(2005年)

摘要

應用系統封裝技術於射頻前端模組之研製
學生：李威弦 指導教授：黃建彰 博士
元智大學通訊工程研究所

中文摘要
本論文主要為採用多層電路板技術設計工作在 2.4GHz 頻段之射頻傳收前端模組，電路先以分立式 (Discrete) 功率放大器及射頻開關為主動元件所構成，並搭配上集總 (Lump) 型式之濾波器及邏輯開關控制電路來設計之後，使得整體模組尺寸可縮小至 12.3 mm x 14.6 mm 尺寸實現之。接著再進一步的以系統構裝 (System-in-Package, SiP) 角度將模組中之主動元件如功率放大器及射頻開關改以晶片直接承載 (Direct Chip Attached, DCA) 於印刷電路板基材 (Substrate) 上的方式，並且透過鎊線 (Wire-bonding) 與表面黏著元件做電氣連接，同時也將原先採用集總式之帶通濾波器及低通濾波器改以傳輸線耦合方式設計而成之印刷式微波濾波器。藉以達到相同效能以及成本降低為目標。

關鍵字

系統封裝技術 ； 射頻前端模組

並列摘要

Design and Fabrication of RF Frond-end Module using System-in-Package Technology.

Student：Wei-Hsuan Lee Advisor：Dr. Chien-Chang Huang

Institute of Communication Engineering
Yuan Ze University

ABSTRACT

In this thesis the 2.4 GHz RF frond-end modules (RF FEMs) are designed and fabricated using printed circuit board (PCB) technologies for wireless audio/video applications. This first module utilizes the commercial components including a power amplifier (PA) IC and two RF switches with the ceramic band-pass, low-pass filters and some logic control circuitries to verify the designed concept and evaluate the module performance. The total size of the first module is reduced to 12.3 mm x 14.6 mm, and it could be more compact using some system-in-a-package (SiP) techniques. Therefore the next version FEM is assembled by the un-packaged chips of the PA and RF switches on the FR4 substrate through wire bonding with other surface mount components. In addition, the commercial filters are substituted by printed circuit ones such as combline and hairpin filters in the second and third versions. These designs not only reduce the module size but also lower the manufacture costs, and would be very attractive for the wireless communication applications.

並列關鍵字

RF Frond-end Module ； System-in-Package(SiP)