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  • 學位論文

IEEE-1394高速資料傳輸系統之信號完整性研究

Studies on Signal Integrity of IEEE-1394 High-Speed Data Transmission Systems

指導教授 : Dr. Chien-Chang Huang
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摘要


隨著主機板外頻速度的提昇,以及可攜式消費電子產品寬頻通訊的需求日增,帶動互連元件(如印刷電路板、連接器及電纜線等)朝高密度及高傳輸量發展。互連元件因此不再只是訊號連接的架橋,其本身所產生的高頻效應無法再被忽略,這些高頻效應將成為高速傳輸系統的瓶頸之一。 本研究針對1394高速傳輸之介面高速特性,利用模擬及實驗測試兩種方式,有系統的討論連接器、電纜線組到串接系統之串音雜訊,及其對傳輸訊號品質所造成的影響。模擬方面採用三維實體模型,以全波模擬軟體HFSS萃取連接器不同端子接面所產生之S參數,量測部份則利用向量網路分析儀對實體產品直接進行量測,再透過ADS電路模擬軟體對各種S參數進行分析與比對,最後利用諧波平衡法(Harmonic Balance Technique)分析串接非線性系統後的雜訊響應。從數值模擬及實際量測中發現,電纜線受到良好的阻抗控制以及金屬隔離層的保護,具有低輻射及高抗雜訊的特性,因此連接器的阻抗匹配性是電纜線組產生耦合雜訊干擾源的主要原因。 由於有線傳輸介面具有無線傳輸無法取代的高速傳輸特性,透過有線串列傳輸媒介間的高度共通性,本文所做的研究可提供連接器或組裝廠在實際應用或問題解決上一個重要的參考依據。

並列摘要


With the increasing demands of the high cloak-rate applications on PC industries and consumer electronics, the connecting device such as printed circuit boards, connectors and cable assemblies become more important for wideband communications due to their non-idealities of high frequency characteristics. Specifically, the deteriorated effects caused by connecting devices are the major limitation, and in the role of bottleneck, for high-speed transmission. In this thesis, the signal integrity of IEEE 1394 connectors and cable assemblies is discussed in details by means of simulations and measurements. A 3D electromagnetic simulator, High-frequency Structure Simulator (HFSS), is used to acquire the S-parameter of the plug and socket assembly. On the other hand, the measured S-parameter of the 1394 connecting device is also conducted by using the network analyzer. The simulated and measured S-parameter of 1394 connecting devices are incorporated into the Agilent’s circuit simulator ADS to compare the frequency- and time-domain responses. Finally, a harmonic-balance technique is applied to the cascading system for investigating the noise characteristics at nonlinear loading. Numerical simulation and physical measurement indicate that the 1394 cables have the features of low radiation interference and high noise immunity by the well designs of impedance-control and shielding effectiveness. The connectors then dominate the coupled signal interference in cable assemblies, and should be taken care to alleviate the signal impairments. The wire-communications have the advantage of high-speed transmission rather than the wireless links, and still valuable for many applications. This study would be the helpful for the component manufactures of high-speed data transmission in trouble shooting or circuit designs.

參考文獻


[1] U. Wallenhorst and A. Brenner, "High frequency characteristics of modular metric, high-density connector system", IEEE Electrical Performance of Electronic Packaging, pp. 77-83, Portland, OR, USA, October 1995.
[2] A. J. Rainal, "Performance Limits of Electrical Interconnections to a High-Speed Chip", IEEE Trans. on Components, Packaging, and Manufacturing Technology, Vol. 11, pp. 260- 266, September 1988.
[3] C. S. Chang, "An Overview of computer Packaging Architrcture and Electrical Design", Southern Tier Technical Conference, Proceedings of the 1990 IEEE, pp. 239-257, Binghamton, NY, USA, April 1990
[4] C. D. Yoo, "High-speed DRAM interface", IEEE Potentials, Vol. 20, pp. 33-34, December 2001/January 2002.
[5] F. Caigent, S. D. Bendhia and E. Sicard, "The Challenge of Signal Integrity in Deep-Submicrometer CMOS Technology", IEEE Proc. Vol. 89, pp. 556-573, April 2001.

被引用紀錄


陳嘉琪(2008)。具多組高速差動訊號對之模組插座連接器之設計〔碩士論文,國立臺北科技大學〕。華藝線上圖書館。https://doi.org/10.6841/NTUT.2008.00056
蔡明偉(2016)。C6A高頻連接器結構與電容耦合分析與設計〔碩士論文,中原大學〕。華藝線上圖書館。https://doi.org/10.6840/cycu201600529
蔡宗憲(2004)。印刷電路板電源/接地層之電氣特性分析〔碩士論文,元智大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0009-0112200611324130

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