聚乙二醇對反脈衝微盲孔電鍍之影響

The influence of PEG in Micro via pulse reverse plating

許吉昌(Chi-Chang Hsu)

指導教授 ： 尹庚鳴

元智大學/工程學院/化學工程與材料科學學系/碩士(2003年)

摘要

硫酸銅鍍浴由於有溶液穩定、價格便宜、電流效率高及沉積速度快等優點，因此被廣泛應用於印刷電路板業中的導線製作上；聚乙二醇（PEG）為酸性鍍銅中應用最廣也最常見之添加劑，其本身可以提高電鍍時的過電壓，使晶粒細化；反脈衝電鍍（Pulse reverse plating）則擁有良好的盲孔（Blind via）電鍍能力及鍍層有優良的物理性質，然而根據本實驗結果看來，直流電鍍及脈衝電鍍方面有添加劑的情況下可明顯改善其孔內分佈力及表面結晶形態；在反脈衝電鍍中，單一只添加聚乙二醇時，其對於盲孔電鍍之影響並非全面性或有其一定規則性；而良好的孔內分佈則與電鍍參數、聚乙二醇種類及濃度和盲孔形狀有關。

關鍵字

聚乙二醇 ； 反脈衝電鍍 ； 盲孔

並列摘要

The advantages of acid copper sulphate plating solution is stable , price cheaper , high current efficient and high deposition rate. Therefore it is application extensively in PCB industry to fabricate conducting wire. Polyethylene glycol(PEG) is the common additive which was be used extensively in acid copper sulphate plating. The PEG could have higher overpotential and make the grain size thin. Pulse reverse plating has good ability to plating blind via and the deposition layer has good physical properties. Base on this experiment result ,direct current(D.C.)plating and pulse plating the additive could clear improve the throwing power and surface crystallinew form. The influence of single PEG with pulse reverse blind via plating was not overall or has any regulation. The nice throwing power is relationship with the plating parameter, the kind and concentration of the PEG and Blind via configuration.

並列關鍵字

PEG ； Pulse reverse plating ； Blind via

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