物理氣相沉積對FR4及PTFE基材抗撕強度之影響

The effect of physical vapor deposition on the peel strength of FR4 and PTFE substrate

楊富寶(Fu-Pao Yang)

指導教授 ： 洪信國 ； 鄭文鋒

元智大學/工程學院/化學工程與材料科學學系/碩士(2001年)

摘要

本研究在以電漿及金屬濺鍍方法處理FR4及PTFE基材，銅箔蝕刻後將其施以表面處理以1080之Prepreg壓合及RCC壓合後再蝕刻其表面，探討各種不同處理表面之粗糙度、抗撕強度與處理方法及樣品種類之關聯。由本篇論文可知，抗撕強度與Sputter反應時間、反應功率及RF反應時間呈現正比例之關係，即Sputter或RF反應時間愈長、反應功率愈大則其抗撕強度亦會增加。粗糙度與RF反應時間呈現正比例之關係，但與Sputter反應時間卻無一定之關聯。另外FR4基板之抗撕強度較PTFE基板之抗撕強度大，由實驗及結果可知，抗撕強度之大小與RF及Sputter反應時間及功率之參數有關，實際上基材表面組成之成份、官能基及交聯密度也是影響基材與鍍膜抗撕強度之重要因素。

關鍵字

沉積 ； 抗撕 ； 基材

並列摘要

The research is using the plasma and metal sputter to treat the FR4 and PTFE substrate. Etch the copper foil and pertreatment. Than lamination the 1080 prepreg and RCC. The least etch the surface . To discuss relation of the roughness and peel strength. Which used the different surface treatment and the variety samples. From the paper. We should know the peel strength is proportion with sputter reaction time ,reaction energy and RF reaction time. The result is when the sputter time,RF reaction time more longer and reaction energy more larger. The peel strength will be increase. The RF reaction time if more longer the roughness will be step up. But it is not has any relation with the sputter time. Otherwise ,We still know the peel strength of FR4 is more strong than PTFE . From the experiment outcome .We should know that the peel strength is relate, with parameter of the RF reaction time,sputter reaction time and reaction energy. Actuality the substrate surface compound,Functional group and cross-link density is still the important factor of the peel strength.

並列關鍵字

deposition ； peel ； substrate

參考文獻

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