我國印刷電路板(PCB)產業主要是以委託加工製造為主,產品形式高度客製化,屬於接單生產(Build to Order;BTO)型態,由於產品規格及形態隨客戶需求而改變,易造成製程及物料使用上的差異。本研究針對多層印刷電路板在製程前的物料規劃工作進行研究,主要包括三大部份:一、在訂單資訊和生產途程已知的情況下,結合物料表(BOM)與生產途程(Routing)的資訊,用以計算實際生產時各製程所需的物料項目及數量;二、發展一整數規劃模式,以求算各項物料應以規劃期間內之需求作為採購依據,或是以各筆訂單物料需求為採購依據,使其存貨成本最低;三、針對需求使用變異之物料,提出一動態安全存量模式,藉以計算出適當的安全存量,以減少不必要的庫存發生。在研究結果中,以每筆訂單為基礎,可計算出各製程所需之物料項目及數量,並決定訂購各項物料方式為何,其成本會較低;針對需設定安全存量的物料項目,找出影響需求變動的各項因子,而安全存量的設定值則更能與真實生產環境的需求互動結合。
The major type of Printed Circuit Board industry in Taiwan is Original Equipment Manufacturing (OEM), of which products are highly customerized, and belonging the BTO type. As for the specifications and types of products are accompanied with variable customer demands; thus, the differentials of applications on materials and procedures can be easily made. This thesis focuses on solving the material demands of multi-layer PCBs during the pre-schedule period. The main body is divided into three parts as following: 1. Under the circumstances that the order forms data and Routing are already known, combine the information of BOM and Routing. Therefore, evaluate the required material items and quantities of each flowing within the actual manufacturing procedure. 2. Develop an Integer-programming model to evaluate each item of materials based on purchasing rules, which include the demands during planning period or single demand order, to make the lowest stock cost. 3. Pinpoint the demands to use variable materials, so that a Dynamic Safety Stock model has been developed to calculate the adapted stock quantity, minimizing un-necessary stock. As the research results, the required items and quantities of materials are calculated based on each single order form. Also the types of purchasing each item of materials are determined to lower the cost. Then, concentrate on the items of materials, which require safety stock setup to search for the variable factor that influences demand. Finally, the setup value of safety stock can be fitted the real manufacturing demand.