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  • 學位論文

電腦輔助多層印刷電路板製造途程規劃

Computer Aided Routing Planning for Multilayer Printed Circuit Board Fabrication

指導教授 : 鄭元杰 博士
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摘要


台灣電路板產業的屬性是屬代工性質,即接受客戶委託負責生產空板,因此,生產時效的爭取與成本的控制即成台灣電路板廠商獲利的指標,但是目前台灣電路板產業的製造途程規劃均是由人工來進行,如此不但無法掌握成本與時效,在面對電路板細線小孔與多層化的趨勢之下,如何及時針對產品個別的差異提供符合效率與成本考量且彈性的製造途程就成為一重要課題。 針對此一問題本研究提出一系統性的製造途程分析方法找出各種可行途程,並對各個可行途程之優劣作一探討。本研究以產品的組合結構為基礎做為製造途程規劃的基本架構,並以盲埋孔的分佈狀況來決定壓合的順序,根據此架構與順序配合以各種的製程技術來找出各個可行的途程。最後,提出三因子加權分析法從品質、成本與加工時間三個角度來評估製造途程之優劣,而藉由因子評比與權重的設定,可更彈性與更經濟的找出適合產品本身特質的途程。此法可有效的縮短設計週期與降低生產成本,並在這樣的前提之下找出最符合使用者期望與產品特質的製造途程。

並列摘要


The attribute of the Taiwan PCB industry is belong to the Original Equipment Manufacturing(OEM), namely accept client refer to produce bare board. Therefore, it is important to fight for produce time and grasp of the cost, but the manufacturing routing planning of the current Taiwan PCB industry all proceed from the manual. To face the circuit board become fine thread、small eyelet and Multilayer, how aim at the discrepancy of the product individual to provide a efficiency、economically and flexibility manufacturing routing may become a cardinal lesson. Aim at this problem this research drawing out a systematicness manufacturing routing analysis method to find out every workable routing and studying each workable routing’s quality. This research is used as the basic frame that manufacture routing planning regarding the assemble structure of the product and use the distribute condition of buried and blind holes to decide the laminate sequence. According to this frame and sequence to harmony with various processing technique to find out each workable routing. Finally, use “Three Factor Weight Analysis Method” from quality、cost and process time three aspect to estimate the quality of each manufacture routing. By setting factor score and weight we can get a routing who fit production’s characteristic more flexibly and economically. This method can hold true of shortening designing cycle and bring down production cost. And under this premise to find out the manufacturing routing that match user''s expectation and product attribute most.

參考文獻


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6. 李炎燊,「多層印刷電路板製程中組裝與加工次序之整合分析與評估」,碩士論文,元智大學工業工程研究所,1998。
7. 郭建昌,「多層印刷電路板排版方式與製程成本之整合評估與分析」,碩士論文,元智大學工業工程研究所,1999。
15. Gendusa, C., “World Production of PWB’s and Flex Circuit Rose in 1999,” Technology Market Research Council, IPC, 2000, http://www.ipc.org/

被引用紀錄


林友婷(2006)。動態瓶頸有限產能規劃:以覆晶載板生產為例〔碩士論文,中原大學〕。華藝線上圖書館。https://doi.org/10.6840/cycu200600497
楊金聲(2005)。利用類神經網路與線性迴歸進行成本預測之研究-以印刷電路板產業為例〔碩士論文,中原大學〕。華藝線上圖書館。https://doi.org/10.6840/cycu200500367
唐永成(2002)。印刷電路板製造資料模型建構與成本分析〔碩士論文,元智大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0009-0112200611301537
吳承宗(2004)。應用模擬方法於印刷電路板生產排程影響因素之研究〔碩士論文,元智大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0009-0112200611313848

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