新式電子構裝之熱效應分析與熱變形量測

A Study of Thermal Effects and Thermal Deformation for Some of the New Electronic Packaging Components

徐國峻(Guo-Jun Xu)

指導教授 ： 陳永樹

元智大學/工程學院/機械工程學系/碩士(2000年)

摘要

新式電子構裝之熱效應分析與熱變形量測
學生：徐國峻 指導教授：陳永樹
元智大學機械工程研究所
摘要
本研究主要針對電子構裝元件受熱之熱傳效應與變形分析，主要涵蓋分析、理論與實驗三方面。在分析方面，利用有限元素來做電腦模擬，並以QFP、PBGA與Flip Chip為分析的對象。分別就QFP之晶片受熱時，探討從晶片發熱處至PCB板之間的溫度分怖情形。且分析PBGA與Flip Chip受溫升變化所造成的熱應力。除了探討用於電子構裝熱效應方面基本熱阻理論，同時也推導常見於構裝結構上之兩層與多層結構的熱應力的方程式，以供需快速的估算電子構裝層與層之間的應力值時使用。最後於實驗方面，利用陰影疊紋法(Shadow Moire)來分別量測PBGA元件與電路板焊接一起之前、後情況下的表面平整度。並量測二者焊接一起時，模擬元件運作時受到溫度效應影響下，電路板與元件表面的平整度變化。且利用有限元素分析（FEM)相互驗證。以作為元件在製程中迴焊時，接著不良原因之探究。

關鍵字

FC ； PBGA ； QFP

並列摘要

A study of Thermal Effects and Thermal Deformation for Some of the New Electronic Packaging Components
Student：Guo-Jun Xu Adviser：Yeong-Shu Chen
Institute of Mechanical Engineering
Yuan-Ze University
ABSTRACT
In this study, the thermal effects and thermal deformation for some of the new electronic packaging components are investigated. It includes (1)theoretical derivation for the stress among layerd materials as seen in most packaging components.(2)using computer analysis to examine the thermal effects for a QFP when the chip is heated. and (3)the temperature distribution and thermal stress from chip to PCB for a PBGA and a Flip Chip components. Finally, the experiment of using shadow moire technology to measure warpage of PCB and a PBGA component before and after soldering. Also, the deformation of them when subjected to the temperature gradient during component working. Finite element modeling is also used for the verification. It will provide a valuable information when investigating root causes for.bad soldering between the component and PCB.

並列關鍵字

覆晶 ； 塑膠格狀陣列 ； 四方扁平狀構裝

參考文獻

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7. Filip Christiaens and Eric Beyne,"Transient Thermal Modeling and Characterization of a Hybrid Component", IEEE Electronic Packaging Technology Conference,1996,pp.154~164.

8. H. Pape,M. Beyfuss and R. Kutscherauer,"Thermal Management of Packaged IC by Experimentally Verified Fnite Element Modeling",IEEE/CPMT Electronic Packaging Technology Conference,1997,pp.58~64.

10. H. L. J. Pang and T. I Tan,"Thermal Stress Analysis of Direct Chip Attach Electronic Packaging Assembly",IEEE/CPMT Electronic Packaging Technology Conference, 1997,pp.170~176.