IC封裝產業在型態上係為一種訂單式代工製造服務業,其生產完全以客戶之訂單做為依據來生產;產能的需求亦不時的隨著訂單變動而改變,所以在IC封裝業中為了達成客戶交期的要求,產能的規劃將是一個非常重要的工作。若在接獲訂單後,就能針對訂單對產能的需求與生產系統實際現場的最大可負荷產能來做評估,則管理者便可就這些資訊及早對訂單的產能需求與生產系統的產能負荷做調整,而當生產系統在正常產能下,有無法負荷訂單之產能需求的情況發生時亦可及早處理。 在本研究針對IC封裝廠之產能規劃設計了一產能規劃模式,在此規劃模式中是以最大可得之利潤為目標,在考量各項不同價值之產品產出量、外包變動成本、延遲生產成本與產能閒置變動成本下,輸入各項與產品及生產系統之已知資訊,在規劃時間開始正式生產之前預先得知在獲得利潤最大的情況下,各項產品的產出量、各項產品之延遲生產量,或是何種產品的部份製程外包,外包量為多少等決策。
The production type of a IC packaging is made to order. The requirement of the capacity is depending on the orders of customers and the volume of capacity requirement changes by the customers’ orders all the time. And the objective of due date is a very important work which is depending on the manufacturing planning and production control. And the capacity requirement planning is the mid-term capacity planning which will affect the short-term input/output and scheduling. If we can estimate the capacity requirements of orders, compares with workshop’s real capacity load. Then controllers can know about the capacity requires for production system before the manufacturing starting and taking order with it. In this research project proposed a capacity planning module based on the linear planning method using maximum benefits as primary target. Considering the cost of outsourcing, lateness and capacity lying idle to find out the optimal capacity disposition. And to determine the volume of producing, lateness and outsourcing before manufacturing.