本研究針對半導體封裝廠提出ㄧ套無限產能規劃系統。本系統可分為五個模組:(1)在製品指派模組、(2)批量投料模組、(3)生產資源選擇模組、(4)產能堆疊模組、(5)產能平衡模組。在製品指派模組以主生產排程計畫(Master Planning Schedule;MPS)為依據,於生產線末端依序地指派在製品,以滿足MPS之需求數量。當拉引至生產線之前端時,在製品的數量仍無法滿足MPS需求時,則需執行批量投料模組,開始進行投料之需求。在MPS 所需之數量已滿足後,則可透過生產資源選擇模組於各個製程選擇產品批量所需之生產資源,並且推估各批量於各製程之計劃開工時間與完工時間。而透過批量之計劃開工時間,即可開始執行產能堆疊模組,將產品批量所需之產能累計於各天之生產資源上,藉此可評估生產資源各天之產能負荷情形。若生產資源各天產能堆疊狀況不平衡時,則可使用產能平衡模組來平衡生產資源之產能。 本研究以Visual Basic發展產能規劃軟體的雛型,並根據實際之半導體封裝廠資料加以驗證本研究發展之產能規劃系統。藉由實驗設計檢驗產能規劃系統之績效,從實驗設計的結果中顯示,所發展之產能規劃系統可有效平衡生產資源負荷不均之現象,並且減少瓶頸資源之發生。
In this research, a capacity planning system is proposed for an IC packaging plant. Five modules are developed: WIP-Pulling Module, Lot Release Module, Production Resource Selection Module, Workload Accumulation Module, and Workload Balance Module. WIP-Pulling Module pulls WIP from the end of the process route to meet the master production schedule (MPS). If WIP cannot meet the MPS requirement, then it needs to execute Lot Release Module. And then it can choice the right production resource of lot at each process and calculate the lot start time and finish time by Production Resource Selection Module. After calculating the lot start time and finish time, Workload Accumulation Module is used to accumulate the workload of machine and jig in each day. If the workload of machine and jig are unbalanced, Workload Balance Module is used to balance these production resources. A prototype capacity planning software is developed in Microsoft Visual Basic and industrial data of an IC packaging plant are used to test the performance of the capacity planning system. Based on the design of experiments, simulation results show that the capacity planning system is effective and efficient to balance the workload of production resources including machine and jig, especially bottleneck equipment.