The extended finite element method (X-FEM) is originated from the classical finite element method. Consider crack or discontinuity problems. If the crack grows, one must remesh the finite element model along the crack propagation path in the classical finite element method. However, remeshing is not required for X-FEM even if the crack grows. The present work studies (1) a plate containing a single edge crack subjected to uniaxial tension, (2) a plate containing a single edge crack subjected to bending moments, and (3) a substrate crack in a thin film/substrate crack subjected to bending moments. The stress intensity factors together with deformation and stress fields in the cracked bodies are computed using X-FEM and are benchmarked with those obtained by fracture mechanics and elasticity theories. The effects of material mismatch and crack location on the stress intensity factor of film/substrate system are also studied.