在記憶體晶片測試的過程中,需要有一個介面來連結測試機台與晶片,此介面設備我們稱為探針卡。由於此探針卡價值不菲,所以本論文之主旨在於利用模糊控制理論,在不影響測試結果的前提下,制定一套晶圓測試生產前的設定規則來保護此探針卡設備。 由於在一般的測試情況下,環氧樹脂探針卡的壽命是取決於針尖至轉彎處之間的針臂長度,所以此論文使用模糊理論,利用製程的前後順序以及溫度的熱漲冷縮效應做為模糊輸入,模糊輸出為控制探針卡於針測行程下的針尖在鋁墊上所刮出的針痕大小,以減少鋁墊上的鋁削附著於針尖上,除了避免影響測試品質外,也減少探針卡送維修及降低磨針的頻率,進而降低損耗針臂長度,增長探針卡的壽命。另一方面,藉由減少探針卡送修的頻率衍生到效益評估可看出,確實降低了晶圓測試廠的測試成本以及增加產能。
During the process of chip probing (CP), there should be an interface to communicate between the tester and the wafer, that is, the probe card. Probe cards are very expensive. The purpose of this thesis is to try to make a setup rule in the beginning of testing to protect the probe card and extend its lifetime. Of course, the rule cannot let the testing result overkill as a prerequisite. In the normal situation, the lifetime of the epoxy probe card depends on the needle length between the needle tip and the bent position. This thesis employs the procedure and temperature using the fuzzy membership function to control the size of probe mark on the pad to decrease aluminum trifles adhering to the needlepoint; this will affect testing quality and yield. Therefore, we can decrease the frequency of maintenance and damage to the needle tip to achieve the purpose of protection and increase in probe card lifetime. This will reduce the testing cost and increase the productivity of wafer products.