高密度探針卡設計與製造

Design and Manufacturing of Ultra-Fine-Pitch Probe Card

周敏傑 ； 黃萌祺 ； 高端環 ； 黃悅真 ； 羅慶峰 ； 林寶洲

《機械工業雜誌》 471期 (2022/06) Pp. 13-21

摘要

儘管COVID-19疫情對各產業都造成影響，2020及2021年全球探針卡（probe card）市場仍穩健成長，產值超過20億美元。現有之探針卡皆使用金屬材料做為探針主體，要將探針之直線間距（in-line pitch）有效縮小至40μm以下，有其實質的困難。此外，即將進入量產的μ-LED亦急需要開發高密度pitch 15μm以下之探針卡以利量產測試。本文提出一種以超薄無機材料製作微懸臂樑無機材複合探針的構想，並嘗試以雷射誘發深蝕刻及黃光微影電鍍技術，製作出懸臂寬度10～20μm、間距（pitch）20～40μm之指狀無機材料探針結構，並通過100萬次反覆彎曲試驗，未來若開發成功將可應用於μ-LED量產測試。

關鍵字

探針卡 ； 無機材料探針 ； 細間距

並列摘要

Despite the impacts of the COVID-19 pandemic, the global probe card market has grown steadily to over $2 billion in 2020 and 2021. Currently, the probes that being used in the probe card are all made of metal materials, and caused a bottleneck to reduce the in-line pitch of the probes effectively to less than 40 μm. In addition, the testing for mass production of μ-LED also urgently requires the development of probe cards with pitches below 15 μm. In this article a concept of a micro-cantilever inorganic composite probe made of ultra-thin inorganic material is proposed. This article also tried to use laser-induced deep etching, lithography and plating technology to fabricate a finger-shaped inorganic material probe structure with a cantilever width of 10-20 μm and a pitch of 20-40 μm, which has passed 1 million repeated bending tests. If being developed successfully in the future, it can be used for the μ-LED mass production testing.

並列關鍵字

Probe card ； Inorganic material probe ； Fine pitch

參考文獻

周敏傑、陳明良、蔡禎輝、吳東權，“ 先進高密度探針卡技術 ”，機械工業雜誌，318 期，3-12 頁，2009 年。

“Semiconductor test connectivity systems-probe card report,” VLSI Research Inc., April 2021.

J. Broz, “Welcome to the 29th Annual SWTest Conference in San Diego,” presented at 29th Annual SWTest Conference , San Diego, June 2-5, 2019