半導體產業正處於微利時代的環境,各家半導體封裝廠莫不為了如何持續穩定獲利、創造利潤而努力。在封裝價格持續下滑的同時,大多數的封裝廠都遇到了虧損的問題,唯有憑藉正確的經營策略,掌握經營之關鍵成功因素,才能持續且穩定的獲利。 本研究首先透過文獻探討,了解目前半導體封裝產業的現況,並統整出影響經營之關鍵成功因素,分別為八大構面、三十一項細項因素,作為問卷調查的項目,問卷對象為台灣封裝產業之各層從業工程人員、經理級以上管理階層等專業人員。問卷分析採層級分析法,決定出相對權重值,再經由實證確定本研究所提出之關鍵成功因素具有相當程度之可信度以供業界參考。
The IC assembly industry is now situated at slight profit environment. Each company is trying to earn stable profit and create additional revenue. As the assembly price is continuing going down, most of the companies are making a loss. Only getting over the key success factors by means of correct management strategy can we make a profit stably. The research firstly focuses on understanding the current situation of Taiwan IC assembly surroundings via case study. The research then find out the Key Success Factor which is divided into 8 concept areas, 31 key factors to be the items of questionnaire survey. The survey targets at engineering, operation, and management of assembly industry. The questionnaire analysis bases on AHP(Analytic Hierarchy Process) methodology to figure out the relative weight value. The KSFs in the research are proved by actual statistical method to ensure the reliability.