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  • 學位論文

複合式塑膠薄膜用於微結構熱壓成型品質改善之研究

The quality improvement of microstructure embossing process with composite plastic film

指導教授 : 陳雲岫
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摘要


本公司結合光學設計,運用類 LIGA(LIGA-Like)製程之相關技術,使用微結構熱壓成型工法搭配複合式塑膠薄膜,生產出一具有特殊微結構及光紋效果的塑膠薄膜。本文將利用微結構熱壓成型製程之各種參數組合,透過部分因子設計法實驗後進行研究與分析,找出該製程影響複合式塑膠薄膜產出品質之製程顯著因子,訂出該薄膜較適用於本公司微結構熱壓成型量產之製程參數條件,藉由生產製程條件之控制來提高複合式塑膠薄膜用於微結構熱壓成型製程之產出良率,以增加產品競爭力,也期望透過本研究能提升公司在微熱壓成型加工領域之技術與發展。

關鍵字

微結構 熱壓 品質改善

並列摘要


Our company produces a plastic film with special microstructure and streak effect by combining the optical design and adopting LIGA-Like process related technologies in the microstructure embossing process collocated with composite plastic film. This article will makes use of various parameter combinations of microstructure embossing process to find out significant process factors that affect the quality of composite plastic film through researches and analysis on fractional factorial design method experiments, so as to stipulate the process parameter conditions of the film adapting to the mass production microstructure embossing process of our company. By controlling the production process conditions, the output yield of the composite plastic film in the microstructure embossing process will be increased to improve the product competitiveness. Meanwhile, it is also expected to improve the technology and development of our company in the microstructure embossing process field through this research.

並列關鍵字

microstructure embossing quality improvement

參考文獻


[1] H. Becker, U. Heim. ”Hot embossing as a method for the fabrication of Polymer high aspect ratio structures,” Sensors and Actuators, pp. 130-135. 2000.
[2] H. Becker, U. Heim. ”Silicon as tool material for polymer hot embossing,” IEEE Con’, pp. 228-229. 1999.
[3] D. Harry, P. William. ”Polymer deformation and filling modes during micro embossing,” J. Micromech. Microeng 14, pp. 1625-1632. 2004.
[4] L.J. Heyderman, C. Schift, J. David, T. Gobrecht, L.J. schweizer. ”Flow behavior of thin polymer films used for hotembossing lithography,” Microelectronic Engineering 54, pp. 229-245. 2000.
[5] N.S. Ong, Y.H. Koh, Y.Q. Fu. ”Microlens array produced usinghot embossing process,” Microelectronic Engineering 60, pp. 365-379. 2002.

被引用紀錄


楊閔豪(2014)。提升氣囊式緩衝包裝袋良率之研究〔碩士論文,國立臺北科技大學〕。華藝線上圖書館。https://doi.org/10.6841/NTUT.2014.00759

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