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新型微拉伸測試儀之開發及其於薄膜材料機械性質量測之應用

Development of Novel Micro Tensile Testing Instruments and Application in Characterizing Thin Films Mechanical Properties

摘要


對於設計與應用微機電元件,薄膜材料的機械性質是相當重要的依據,其中拉伸測試可以透過簡單的力學行為萃取薄膜材料的機械性質。筆者以國立清華大學微機電實驗室所開發之新型微拉伸測試儀為例,說明微拉伸測試儀元件設計、製造與測試的流程。同時亦提出一嶄新的概念,使用高分子材料-聚對二甲苯整合於製程之中,其優越的抗酸鹼能力,可作為保護待測材料之保護層,以避免製程中乾、濕蝕刻的攻擊,達成可多樣化待測材料的微拉伸測試儀之製程平台。透過黃光微影製程將待測材料與測試儀器整合,亦可降低組裝與對準的誤差。文中將介紹設計原理、機械結構、致動模組及感測模組等,亦針對該儀器之特性進行校正,最後利用此儀器對待測材料進行拉伸測試,量測薄膜機械性質。

關鍵字

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並列摘要


The mechanical properties of thin film is very important information to design and apply MEMS devices. Tensile testing can extract the mechanical properties by simply mechanical behavior. There are even more on-going researches involving in the mechanical properties testing related fields. In the article, the authors research group in the Micro-Device Lab., National Tsing Hua University would like to introduce the design and fabrication of the tensile testing instrument. It's not easy to integrate the test specimen with the testing instrument due to etch selectivity. This research will provide a brand-new concept, using parylene passivation technique to protect the test specimen during etching processes. Parylene is a very inert chemically to the various etching test. The parylene passivation technique allows the user to change the test sample easily using the same fabrication process. Furthermore, the problems and difficulties resulting from the alignment and assembly of a thin film test specimen with the testing instrument can be prevented. The MEMS instrument consists of a thermal actuator, differential capacitance sensor, and supporting spring. Moreover, the load and displacement relationship can be calibrated by commercial instruments. In application, this study can be determining the mechanical properties.

並列關鍵字

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被引用紀錄


林宜中(2014)。以SOI晶片實現新型微機電拉伸試驗〔碩士論文,國立清華大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0016-2912201413503273

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