水冷式機櫃水流分佈特性之研究

The study of flow distribution of water cooling system in a rack

張育傑(Yu-Jie Chang)

指導教授 ： 林育才

元智大學/工程學院/機械工程學系/碩士(2011年)

https://doi.org/10.6838/YZU.2011.00288

摘要

本文以實驗分析水冷系統在機櫃中分支流的水流分佈特性，包括改變入口流量、出入口配置和集管長度之實驗分析，希望藉此實驗之分析結果，了解入口流量、出入口配置和集管長度的不同變化，對分支流的流動分佈影響，同時了解重力在大型熱交換器中對流動分佈的影響。
本研究所獲得的結果如下：(1)U型配置比Z型配置有更均勻的流動分布。(2)在出口向下的配置中，重力會影響流動的不均勻度，當總流量較高時，不均勻度會下降；反之，總流量較低時，不均勻度則會上升。(3)入口的噴流現象不一定會使不均勻度上升。

關鍵字

機櫃 ； 水冷系統 ； 集管 ； 流動分佈 ； 平行流熱交換器 ； 重力

並列摘要

This paper presents experimental results concerning the flow distribution of water cooling system in a rack. The parameters studied included the flow rate, manifold configuration and the length of header. The effect of gravity has also been investigated on the flow distribution.
The experimental results of this research be summaried as follows: (1) the flow distribution of the U-type configuration is more uniform than that of the Z-type. (2) Gravity shows more pronounced effect on uniformity of flow distribution when the outlet is located in lower position. For a higher inlet flow rate, the uniformity is founded worse. (3) The phenomenon of jet flow near the inlet does not necessarily increase non-uniformity of flow distribution.

並列關鍵字

flow distribution ； gravity ； Rack ； water cooling system ； header

參考文獻

[2]ASHRAE,. “Datacom Equipment Power Trends and Cooling Applications,” Atlanta, GA: American Society of Heating, Refrigeration and Air Conditioning engineers, 2005.

[3]Ellsworth, M.J. ”The Evolution of Water Cooling for IBM Large Server Systems: Back to The Future”, Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2008. 11th Intersociety Conference.

[6]Chiou, J.P., “The effect of nonuniform fluid flow distribution on the thermal performance of solar collector”, Solar Energy, 1982.

[8]Datta, A.B. and A.K. Majumdar, “flow distribution in parallel and reverse flow manifolds.” International Journal of Heat and Fluid Flow, 1980.

[9]Choi, S.H., S. Shin, and Y.I. Cho, “The effect of area ratio on the flow distribution in liquid cooling module manifolds for electronic packaging.” International Communications in Heat and Mass Transfer, 1993.