製程參數對液晶顯示器異方性導電膜品質之影響與評估

Effect and Evaluation of Process Parameters on the Quality of An-isotropic Film in Liquid Crystal Display Manufacturing

徐昇源(Sheng-Yuan Shyu)

指導教授 ： 莊瑞鑫

元智大學/工程學院/化學工程與材料科學學系/碩士(2009年)

摘要

現今液晶顯示器市場競爭激烈，鄰近國家不斷的投資與興建次世代廠房，主要的用意是持續開發新技術，使品質不斷精進並降低成本以獲得更高的利潤，因此必須改善製程問題使技術不斷創新，同時提升產品品質，進而提高利潤。本文以異方性導電膜特性進而改良模組構裝技術，進一步改善液晶顯示器模組構裝製程，減少產品的成本及增加可靠度。
液晶顯示模組中的晶粒軟膜接合封裝製程(Chip On Film，COF)接合技術主要包括三大製程，依序為異方性導電膜貼付、驅動IC對位貼合(顯示器術語稱之為假壓著)、IC壓著接合(顯示器術語稱之為本壓著)製程。本研究則針對異方性導電膜與液晶顯示器的品質進行深層的探討。
本文運用品質分析方法進行關鍵製程的探討，知道異方性導電膜與壓著溫度(T)、壓著壓力(P)以及壓著時間(t)有關。經由要因分析結果可知(1)面板側IC偏移(2)面板側壓著不良(3)金屬異物(4)印刷線路板（Printed Wiring Board，PWB）側偏移(5) PWB側壓著不良，與液晶顯示器的品質關係密切。而影響COF構裝製程問題為金型、驅動IC原材、壓刃機構平行度及PWB尺寸（長度、厚度）為主因。廠區改善前（96年7月到12月）的不良率是隨著時間節節升高，而改善後（97年1月到6月）不良率是隨著時間減少，不良率甚至低於0.01。比較改善前後的不良率由7％降至1％以下，有明顯的大幅度的改善。

關鍵字

液晶顯示器,異方性導電膜

並列摘要

In this text, The characteristic of the conductive particles module would be studied and trying to make much improvement for the technology of the LCD module COF package. The final goal is reducing the cost and increasing the reliability.
The discussion of the key process is use by quality control analysis methods in this text. We know the bonding Temperature (T), Pressure (P) and bonding time (t) would be the importable of the conductive particle module process. We can get the results from cause analysis as following: (1) IC shift (2) Poor bonding of cell (3) metal particles (4) PWB shift (5) poor bonding of PWB. All above mention is much concerned with the quality of LCD. The effect of the COF package process problem is punch, IC warpage, pressure mechanism parallelism and the dimension (length, thickness) of the PWB. Furthermore, we can find the best level combination of the process parameter. We Compared with improvement around, the defect rate is reduce 7％to 1％.

並列關鍵字

TFT LCD,ACF

參考文獻

Chan Y.C., and D.Y. Luk, “Effects of Bonding Parameters on the Reliability Performance of Anisotropic Conductive Interconnects for Flip-Chip-on-Flex Packages Assembly II. Different Bonding Pressure,” Microelectronics Reliability 42, 1195-1204, (2002)

Chang Shyh-Ming, Jwo-Huei Jou , Adam Hsieh, Tai-Hong Chen, Ching-Yum Chang, Yung-Hao Wang and Chun-Ming Huang, “Characteristic Study of Anisotropic Conductive Film for Chip-on-film Packing, ” Microelectronics Reliability 41, 2001-2009, (2001)

Dudek , R., A.Schubert, S.Meinel, and B.Michael, “Flow Characterization and Thermo-mechanical Response of Anisotropic Conductive Film,” IEEE Proceedings of 3rd International Conference, 68-75, (1998)

Jung, I., T.Lee, J.Break, and H.Kim, “Optimization of TAB Inner Lead Bonding Process,” Anmual IEEE Semiconductor Thermal Measurement and Management Symposium, 129-135, (1996)

Jeang Angus, Chien-Ping Chung, Chung-Wei Chen, and Huan-Chung Li, “Optimizing Process Parameters of Hot-bar Soldering Process Through Quality Function Deployment and Taguchi Method,” Journal of Materials Processing Technology Protec-12256, 11, (2008)