- 學位論文
考慮單元最大負載電容的繞線提升技術的2.5D積體電路拆分製造上的雙重安全防禦方法
A Doubly Secure Defense Approach on 2.5D IC Split Manufacturing considering Cell Max Load Capacitance and Wire Lifting Technique
延伸閱讀
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- Huang, Z. X. (2021). 一種新型雙重保護的分裂製造防禦模型並同時搭配線段提升演算法下的2.5D積體電路設計 [master's thesis, National Tsing Hua University]. Airiti Library. https://www.airitilibrary.com/Article/Detail?DocID=U0016-0209202114075075
- Huang, L. R. (2013). 適用於2.5維積體電路之中介層連接線的參數性故障測試和效能估測之研究 [master's thesis, National Tsing Hua University]. Airiti Library. https://www.airitilibrary.com/Article/Detail?DocID=U0016-2511201311374294
- 陳亭志、劉正禮、蘇國瑋、鄭辰仰、王玉城（2018）。Application of Industrial Engineering Concepts and Techniques to Ambient Intelligence。管理與系統，25(3)，367-379。https://doi.org/10.29416/JMS.201807_25(3).0004
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