應用X射線薄層描繪法於PCB與BGA檢測之研究

The Study of Using X-Ray Laminography on PCB and BGA Inspection

陳宏吉(Hung-Chi Chen)

指導教授 ： 林士傑

國立清華大學/工學院/動力機械工程學系/碩士(2007年)

摘要

對高度競爭的電子產業而言，製程後續的檢測過程不僅可以提高產品的良率，更能減少在不良品上加工的浪費。目前廣泛採用的二維自動光學檢測(Automatic Optical Inspection)設備，在無鉛製程以及高密度化的發展趨勢下，已經不敷使用，因此能夠進行三維結構重建的影像處理方法逐漸嶄露頭角。本研究模擬採用X射線電腦薄層描繪法(X-Ray Laminography)來進行檢測，主要看重該方法的運算速度較能符合電子產品快速檢測的需求。本研究將針對X射線電腦薄層描繪法重建影像的參數進行探討，其中包含運動型態、疊加張數和投影傾斜角度，以藉此加強重建品質，並且應用在多層印刷電路板和BGA錫球的內部結構重建上，期望能快速且精準的檢測出是否含有內部瑕疵或缺陷。

關鍵字

X射線薄層描繪法 ； PCB檢測 ； BGA檢測

並列摘要

As to high-competitive electronic industry, the inspection of follow-up process not only enhances production yield but also reduces the waste of manufacture at failure. At present, traditional two-dimension automatic optical inspection machine is already useless under the tendencies of Pb-free manufacturing process and higher component density. Therefore image processing that can rebuild the three-dimensional structure show up prominently gradually.
This research simulation adopts the X-ray Laminography to measure, value the demand that the high-speed operation of this method can relatively accord with the inspection of the electronic product mainly. The object is to study effects of some system parameters on the reconstruction quality. The system parameters studied include the kinematical type of the system, number of synthesized image and the projection angle. It expects that the measuring of the sample is able to be found the inside flaw or the defect is existing or not.

並列關鍵字

X-ray Laminography ； PCB inspection ； BGA inspection