本論文研究的目的是應用六標準差DMAIC手法與運用田口方法,改善凸塊製程(Bumping process)產品良率不佳與產品可靠度的問題,衍生客戶不滿意度、技術能力無法突破,造成被競爭對手超越、市占率下滑、製造成本提高等窘境。因此,希望透過本研究標準化品質績效不彰的改善過程,消弭品質不良成本、客戶流失、技術能力停滯等不利公司成長的因素。作為未來提供IC封測廠工程、研發單位對於產品設計不佳與品質不良,有一套系統化解決步驟之參考依據。最終,藉此個案分享整體改善時程效率不但達標,並且還較目標值提早三天完成、良率提升11.84%、每月平均預估營收效益提高約3300萬台幣、製程能力提升一倍標準差以上。
The main purpose of this paper is to employ Six Sigma DMAIC and Taguchi methods to improve upon poor yield and product reliability issues common to the Bumping process. Poor yields and low reliability have led to customer dissatisfaction, inability to breakthrough technical bottlenecks, being overtaken by market competitors, losing market shares as well as increasing production costs. This investigation has thus standardized the improvement procedures taken in response to poor quality performance in order to mitigate negative factors affecting company growth such as cost of poor quality, loss of customers, and stagnation of technical capacities. Results of this investigation shall provide research and development units of IC assembly and test companies with a reference and basis for a systematic approach on overcoming poor product design and quality. Finally, after employing the improvements proposed in this investigation, a specified target company was able to meet their specified deadlines and even achieve their goals 3 days ahead of schedule, improve yield by 11.84%, increase average monthly revenue by NT$ 33 million, and improve process capability by more than 1 sigma.