隨著電子產品生命週期的縮短與愈加劇烈的競爭,電子產品的售價下降迅速,廠商的成本壓力就越來越大,尤其在半導體製造業,這幾年產品售價下降的速度已大於成本下降的速度,依此情況下去,利潤將越來越薄, 半導體業者無不絞盡腦汁想增加價值,以提高獲利,而成本下降是最基本的功課,450mm(十八吋) 世代是否真的可以成本下降,為業界帶來好處? 此論文就以紫式決策分析架構及波特五力分析、超優勢競爭、經濟面的成本分析等來探討450mm 晶圓世代是否必要。 競爭激烈的環境中及資訊技術的進步讓知識的傳遞更快速,造成任何的優勢或進入障礙很快就會被打破,每個企業只能在創新循環中建構及維持暫時性競爭優勢,所以需要一直不斷的創新,才能保持競爭力而不被超越。 成本下降不是那麼容易也不見得是保持競爭力的最佳方法,但至少是最基本的方法,文中的450mm 與300mm 的成本比較,提醒了機台折舊完畢後的比較關係,由於線寬微縮的世代演化越來越慢,機台堪用年限也越長,本文建議應以十年的生產期間來比較450mm 與300mm 的成本關係,以避免變動成本過高而喪失競爭力。在假設每片晶圓的成本項目,像間接材料的用量或廠物設施成本等都假設450mm 相對於300mm 的倍數與300mm 相對於200mm的倍數是一樣的情況下,本研究推估於大量生產時450mm原始晶圓的價格需為300mm 的三倍以內,450mm 世代才能做到像300mm 世代時業界預估的 30% 晶粒成本的節省。文中並以SWOT分析不同業別的立場,並探討其爭論點。以對消費者及整體產業鏈而言, 450mm世代比300mm Prime有較多的機會可以以消耗較少的資源有同樣的晶粒產出,也就是成本的節省。本研究建議半導體業該投入資源爭取機會以激發更多的創新,在共享研發平台以節省研發經費及可控制的風險下,450mm 世代的開發勢難避免。
Accompanying the increasingly shortened life cycle of electronic products and intensive competition, product price erosion is becoming more serious. As enterprises face pressure to reduce cost, especially in the semiconductor manufacturing industry. The rate of price erosion is faster than the cost reduction rate and as a result, profit is declining. Cost reduction is the most basic approach to gain higher profit. Will the 450mm wafer generation dramatically decrease the manufacturing cost and have positive impact on the entire semiconductor industry? This research is based on UNISON decision model and Porter’s “Five competitive forces” analysis and wafer cost analysis to examine the necessity of the 450mm wafer generation.Under a business environment of intensive competition and accelerated information technology transfer speeds, any competitive advantage or entry barrier will quickly be destroyed. An enterprise can only maintain its advantage for a very limited period of time. So, each enterprise requires continuous innovation to avoid being overtaken. If we assume the parity of each cost item for the 450mm wafer relative to 300mm wafer is same as 300mm relative to 200mm, the raw wafer cost of 450mm wafer should be less than three times that of 300mm wafer when in a mature mass production environment. Without that, 450mm wafer generation can’t meet the industry expectations of die cost savings 30% compared to the 300mm generation.This research also uses SWOT to analyze the different strategy between wafer manufacturer and equipment supplier. Considering the opportunities of consuming less resources and gaining more benefits, this thesis suggests semiconductor industry to develop 450mm generation collaboratively and to inspire more innovations.