溫度效應於三維整合晶片掉落可靠度影響之研究

Investigating the Temperature Effect of Reliability on Integration IC 3D Packaging under Drop Test

陳顥之(chen, hao chih)

指導教授 ： 江國寧

國立清華大學/工學院/動力機械工程學系/碩士(2013年)

摘要

由於科技的發展及使用者的需求，電子封裝元件由傳統的單顆晶片演進到多顆晶片堆疊，即稱為三維晶片封裝，此封裝結構主要優點在體積小及能有較短的電訊延遲，因此被廣泛運用於手持式的電子產品之中。而手持式的電子產品也因為其可攜帶性的特質而常有掉落的情形發生，且掉落情形若是發生在使用過程中其封裝結構的操作溫度會高於室溫，尤其對三維封裝結構更是明顯，因此本研究除了著重可靠度的探討外，考慮溫度效應尤其以溫度超過材料的玻璃轉換溫度對掉落可靠度的影響進行探討。
近年來測試板層級的掉落測試被廣泛用於評估封裝結構受掉落撞擊的可靠度，同時模擬的部分則是以Input-G方法來進行掉落動態行為的分析。為了探討玻璃轉換溫度效應的影響，本研究利用一簡化有限單元的模型進行溫度負載由25℃升至90℃的熱應力分析，結果顯示若膠材考慮溫度超過玻璃轉換溫度後較大的熱膨脹係數，則有用底膠的結構反而比無底膠結構的可靠度還差。本研究利用LS-DYNA 3D進行隱式-顯式連續求解，探討溫度效應對掉落撞擊下錫球破壞機制的影響，並利用文獻實驗進行驗證。建立另一無底膠之真實三維晶片整合有限元素模型，並利用壽命預估模型與累積損傷理論，進行壽命預估。探討當環境溫度超過玻璃轉換溫度後對熱應力分析及掉落行為之影響。

關鍵字

三維晶片封裝 ； 掉落測試 ； 玻璃轉換溫度 ； 掉落可靠度 ； 底膠

並列摘要

Due to the development of technology and the users demand, electronic packaging has been evolved from the traditional single chip package to a multi-chip package, i.e., three-dimensional integrated circuit package. The main advantages of three-dimensional integrated circuit package are small size and lower signal delay, thus it has been broadly used in mobile electronic device. Mobile electronic devices are prone to be dropped because of the portable characteristic. During drop impact, the temperature inside the packages is higher than ambient temperature especially for three-dimensional package. The reacher focused on the drop reliability considering glass transition temperature effect.
Nowadays board level drop test is widely used for estimating the reliability of packaging subject to impact. A simulation with Input-G method was adopted to analyze the dynamic behavior of packaging. To analyze the effect of glass transition temperature, a simplified finite element model was constructed and subjected to a temperature loading from 25℃ to 90℃ for thermal stress analysis. The result showed that the reliability of structure with underfill might be worse than that without underfill when the temperature loading is higher than the glass transition temperature, meanwhile the CTE of underfill is too large. To Investigate temperature effect on the failure mode of solder joints during drop impact, the study perform an implicit-to-explicit sequential solution by LS-DYNA 3D and validated with experiment from literature. Finite element model without underfill was established based on real 3D IC integration package to predict the drop life through life prediction model and cumulative damage theory. To investigate the effect on thermal stress analysis and the behavior of drop impact while ambient temperature exceeding glass transition temperature.

並列關鍵字

3D IC integration packaging ； drop test ； glass transition temperature ； drop reliability ； underfill

參考文獻

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[2] E. J. Cheng, Y. L. Shen, “Thermal Expansion Behavior of Through-Silicon-Via Structures in Three Dimensional Microelectronic Package,” Microelectronic Reliability, vol. 52, Issue 3, pp 534-540, 2012

[3] C. T. Kuo, M. C. Yip, K. N. Chiang, “Time and Temperature-dependent Mechanical Behavior of Underfill Materials in Electronic Packaging Application,” Microelectronic Reliability, vol. 1, Issue 4, pp. 473-483, 2004

[5] JEDEC Solid State Technology Association, JESD22-B111: Board Level Drop Test Method of Component for Handheld Electronics Products, 2003.

[7] J. E. Luan, Tong Yan Tee, Eric Pek, Chwee Teck Lim, Zhaowei Zhong, and Jiang Zhou, “Advance Numerical and Experimental Techniques for Analysis of Dynamic Responses and Solder Joint Reliability During Drop Impact,” IEEE Transactions on Components and Packaging Technologies, vol. 29, Issue 3, pp. 449-456, 2006