新式熱壓製程對於三維晶片封裝之接合可靠度分析與研究

Analysis and investigation of assembly reliability for 3D-ICs packaging by using novel thermo-compression processes.

曾再良(Tsai-Liang Tseng)

指導教授 ： 李昌駿

中原大學/工學院/機械工程研究所/碩士(2014年)

https://doi.org/10.6840/cycu201400923

摘要

對於3D-IC封裝元件應用，封裝隨應用產品的需求被要求需能承受某種程度大小之熱疲勞。由於現代材料的多組合性與結構的尺寸多樣化，在使用過程中受到熱循環負載與受剪切的負載，各材料的熱膨脹係數不一樣會因熱膨脹不匹配，所受的破壞型態各有不同。而封裝結構主要損壞的原因有不同材料間的脫層、晶片斷裂與微凸塊剪斷。
本研究是利用有限單元分析研究分析模擬封裝結構體，在有限單元法中使用的網格與元素假如過多，要造成計算上會消耗大量的時間與容易失效。採用對封裝結構影響最小的微凸塊等效化，分別要算出等效楊氏係數、等效剪切模數與等效熱膨脹係數，將可以消除大量的網格量與元素，以節省大量的運作時間。使用因子設計分析晶片厚度尺寸、基板厚度尺寸底填膠楊氏係數與底填膠熱膨脹係數等四因子進行三水準分析，觀察矽晶片翹曲量與微凸塊等效塑性應變之影響，選擇設計對於封裝體的優化結構。結果指出底填膠熱膨脹係數其值愈大，會使微凸塊等效塑性應變影響之大，會使整體封裝結構破壞失效。
本論文之模擬分析結果，可觀察到底填膠的熱膨脹係數影響為顯著，使用低熱膨脹係數可以讓封裝體受到的變形為最低，當底填膠熱膨脹係數為10ppm/oC，此時可視為3D-IC封裝結構優化設計。

關鍵字

有限元素法 ； 因子設計分析 ； 底填膠

並列摘要

For 3D-IC packaging device applications, packaged applications with demand requirements need to be able to withstand some degree of thermal fatigue sizes. Due to the size and structure of the composition and more modern materials diversification, and subjected to thermal cyclic loading in shear loads during use, the thermal expansion coefficients of different materials may not match the thermal expansion, have suffered damage patterns different. The package structure of the main causes of damage to the delamination between different materials, and micro bumps cut chip breakage.
This study is the use of finite element analysis simulation package structure analysis, because of grid and elements used in the finite element method, if excessive, resulting in the calculation will consume a lot of time and easy to failure. Using minimal impact on the package microbumps equivalent , respectively, to calculate the equivalent Young's modulus, shear modulus and equivalent coefficient of thermal expansion, will be able to eliminate a large amount of mesh elements to save a lot of operating hours.Factorial design analysis using chip thickness dimensions, substrate thickness dimension WLUF Young's modulus and WLUF thermal expansion coefficient such as a four factor three level analysis to observe the amount of chip warpage microbumps equivalent plastic strain. Select the design for the optimization of the structure of the package. The results indicated that WLUF thermal expansion coefficient greater, will make better microbumps equivalent plastic strain influence, failure would undermine the whole package.
Simulation results of the analysis of this thesis, can observe the effects of WLUF thermal expansion coefficient of the most significant. Low thermal expansion coefficient allows to reduce the impact of the package suffered when underfill adhesive thermal expansion coefficient of 10ppm/oC, As this time, can be regarded as 3D-IC packaging structure optimized design.

並列關鍵字

Finite element method ； Factorial design analysis ； WLUF

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