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  • 學位論文

以金屬有機氣相沉積法成長p-型氮化鎵薄膜及其金屬歐姆特性分析

MOCVD growth of p-type GaN and related Ohmic contact analysis

指導教授 : 溫武義
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摘要


中文摘要 本論文重點乃在於利用具多片同時成長之有機金屬氣相磊晶( MOCVD )裝置,成長氮化物半導體‧由過去的經驗可以知道,對於製造高性能的藍綠光發光二極體而研言,如何成長出高品質的p-型氮化鎵磊晶薄膜是一重要之課題‧當然;除了磊晶成長技術外,製程技術也對藍綠光發光二極體之性能具有顯著之影響,此關鍵製程技術包括p-型透明歐姆電極下面就有關P型摻雜層、P型摻雜層的活化及P型歐姆接觸、作一概略性的描述。

關鍵字

氮化鎵

並列摘要


In our study we use metalorganic chemical vapor deposition (MOCVD) to growth p-type GaN. Substrate temperature was set at 1170℃ with ammonia flow rate at 3.5 l/min and TMGa flow rate was equal to 20 sccm. We varied the flow rate of CP2Mg from 0.036 to 0.87 sccm. Thus, the CP2Mg/TMGa ratio (further, R) was varied within the region of 0.18%-0.435%. Post-growth annealing was applied to activate p-type conductivity.

並列關鍵字

p-GaN

參考文獻


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[7] J. Bardeen, Surface states and rectification at a metal-semiconductor contact, Phys. Rev. 71, 717-727 (1947).
[8] A. M. Cowley and S. M. Sze, Surface states and barrier height of metal-semiconductor systems, J. Appl. Phys. 36, 3212-3220 (1965).
[9] E. H. Rhoderick, Metal-semiconductor Contacts, Clarendon Press, Oxford (1978).
[11] G. S. Marlow and M. B. Das, “The Effects of Contact Size and Non-zero Metal Resistance on the Determination of Specific Contact Resistance,” Solid-State Electronics. Vol. 25. No. 2, pp. 91-94, 1982.

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