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  • 學位論文

晶圓製造廠考慮等候時間限制之產能規劃研究

Capacity Planning of Wafer Fabrication with Time Constraint

指導教授 : 陳建良
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摘要


等候時間限制為避免晶圓在製品於生產過程中遭受塵埃微粒污染或銅製程氧化的一個重要生產管理策略,凡超過等候時間限制之晶圓必須被送至某些特定工作站重新加工,此舉勢必增加這些工作站之產能負荷及成本支出。對於最大等候時間設定值之問題解決方法,一般多是仰賴現場工程師的經驗判斷,由於等候時間限制問題牽涉到許多隨機性因素,以致現行的靜態產能規劃方法尚無法將等候時間限制條件納入考量。過去文獻對於此問題之解決模式也大多受限於假設條件,不易落實於真實的晶圓製造廠。本研究利用真實晶圓廠資料並利用AutoSched AP模擬軟體發展一完整之晶圓廠模擬模式,基於此模擬模式並結合實驗設計 (Experimental Design)及反應曲面方法 (Response Surface Method)找出於等候時間限制條件下影響產出及生產週期時間之關鍵因子。實驗結果顯示量測機台可用率 (Availability of Metrology Machine)以及最大等候時間設定值 (Maximum Queue Time Constraint)對於產出及生產週期時間均有顯著之影響,且此二關鍵因子亦存在著一個非線性之關係,此研究結果將可協助管理人員得到更精確的產能規劃分析。

並列摘要


Queue time constraint is one of the important operational management strategies to avoid contamination and copper oxidization in semiconductor manufacturing. Any lot exceeding the queue time constraint needs to be reworked at particular equipment. This leads to an extra capacity requirement and cost increase. Generally, engineers’ experience is used to determine the maximum queue time in practice. It is insufficient to use static model to solve the problem of queue time constraint, as there are many stochastic factors involved. Current literature makes un-realistic assumptions that are infeasible in real wafer fabs. This research develops a detailed AutoSched simulation mode using data from real fabs. Based on this, experiment design and response surface method are used to study the effect of critical factors on the system throughput and cycle time. Simulation results show that the maximum queue time and the availability of metrology equipment significantly influence both system throughput and cycle time.

參考文獻


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被引用紀錄


賴宜伶(2006)。應用限制驅導式於晶圓廠等候時間限制之產能規劃〔碩士論文,中原大學〕。華藝線上圖書館。https://doi.org/10.6840/cycu200600531

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