加入鎳半光澤劑後的電鑄製程參數對光碟模仁品質影響之研究

Influence of Processing Parameters on Disc Stamp Quality by Adding Ni Semi-Bright During Electroforming Process

洪士婷(Shih-Ting Hung)

指導教授 ： 陳夏宗

中原大學/工學院/光機電及資電控產業研發碩士專班/碩士(2007年)

https://doi.org/10.6840/cycu200700027

摘要

電鑄的技術是LIGA製程中重要的一環，影響光阻微結構的複製甚大。本研究深入在LIGA 製程中微電鑄的製程，使用鎳添加劑並搭配製程參數變更來研究影響電鑄品質之因素，以期提升電鑄模仁的機械性質、表面粗糙度與平整度，進而提高光碟成型時的品質與良率。
論文採用胺基磺酸鎳鑄液並添加不同含量的鎳半光澤劑於鑄液中，並配合不同的電流密度與電鑄液溫度參數。從研究結果中，發現加入鎳半光澤劑所電鑄的模仁，其硬度明顯提高，在電鑄液溫度60℃、電流密度13.5ASD、150ml鎳半光澤劑的條件電鑄出的模仁硬度最大高達264HV，跟原始條件(硬度149.5HV)相比硬度提升了76.58%，並且沒內應力所產生的變形。從金相實驗中觀察鑄層橫截面組織，發現加入鎳半光澤劑會使鎳沉積由柱狀沉積轉變為細小層狀沉積，為硬度提升的主要因素。表面粗糙度方面則是利用AFM來量測，在高溫度與低電流密度或加入鎳半光澤劑可以產生較細密的結晶，因此在此條件下可獲得較小粗糙度。在厚度方面，提高溫度與電流密度時晶粒沉積速率越快，在相同時間下沉積的厚度越厚，但是會有模仁內外厚度差異太大造成平整度不佳的缺點，在相同條件下鎳半光澤劑量越多，也會加速鎳的沉積速度，在相同條件下沉積模仁厚度越厚。
本研究中，可以充分了解電鑄製程中鎳半光澤劑的影響，以及在不同電鑄液溫度和電流密度下產生的變化，在電鑄製程時可依模仁需求挑選最適合且最有經濟效率的參數。

關鍵字

微模仁 ； 半光澤劑 ； 電鑄

並列摘要

Micro electroforming technology of the LIGA process is very important and has a great effect on the replication of micro-structure. In this study, the effects of processing and adding Ni semi-bright during electroforming process on disc stamp quality were been investigated.
From the result of study, the stamp of electroforming with Ni semi-bright has bigger hardness. The hardness of stamp has increased 76.58% and reaches the maximum when solution temperature, current density and Ni semi-bright are 60℃, 13.5ASD and 15ml, respectively. The improving of hardness is Ni deposit transition form pillar to layer forms that can be observed the cross section via a metallographic.
For the hardness and surface roughness of the stamp, the higher hardness and lower surface roughness need high solution temperature, low current density and adding Ni semi-bright. The higher solution temperature, higher current density and adding Ni semi-bright will get thicker and not uniform stamp.
Form this study, it will lead to a better understanding on the electroforming characteristics. We can choose and adjust the parameters to get suitable and economic efficiency way during electroforming process.

並列關鍵字

Ni semi-bright ； Electroforming ； Stamp

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