矽晶圓測試流程原理與結果之研究

Principle of probes and its measurement results for silicon wafers

楊金唐(CHIN-TANG YANG)

指導教授 ： 吳燦明

中原大學/工學院/電機工程研究所/碩士(2011年)

https://doi.org/10.6840/cycu201100202

摘要

摘要

本技術報告主要討論的方向有下列幾項 : 1.晶圓生成與測試的介紹 : 本章節將會對晶圓的生成，封裝，及測試做概略性的介紹。2.測試機台與環境的介紹 : 本章節將會對測試Wafer 之機台的規格，特性，與其外觀作介紹。3.測試原理 : 本章節會依此技術報告測試的產品所測試的相關測試項原理加以說明。4.測試程式編寫 : 本章節會將此產品的測試程式編寫加以說明。5.測試結果 : 本章節將會把測試結果所抓取的數據及圖形展現出來。由於現今的科技時代，幾乎隨處可見由IC控制的用品,而IC的心臟不外乎是最原始的chip => Wafer，而測試卻是幫產品品質把關的最後一道防線，就因此重要性，所以我決定就以此一方向做為我技術報告的研究範疇。
此份技術報告將交代產品RK28xx的測試過程，首先我們針對測試機台的規格及其架構做了介紹。接著講解我所編寫的測試程式內，針對這個待測產品所設定的量測範圍，並且對測試程式中各個欲測的測試項目做測試原理的介紹。最後還會對測試的數據結果以及如何改善加以說明，如果測試項目的結果為FAIL，那我會解釋我做了哪些步驟使其測試結果PASS。因為測試結果太容易被各種外來的因素影響，例如:溫度、雜訊、機台穩定度…，所以除了測試程式的編寫是個難題之外，(因為你必須去學會各種不同的測試機台語言) ，另外一個困難的地方就是測試程式的除錯，簡單的說就是把造成測試結果FAIL的因素找出，並利用經驗或是分析來達到PASS的結果，所以測試會帶給我很大的成就感及學習，也是讓我決定拿來當畢業報告的原因。

關鍵字

測試程式 ； 晶圓 ； 測試

並列摘要

Abstract

The discussion topics of this report as below :

1. Growing and testing introduction of wafer: I will introduce concepts of growing, assembling,and testing in this chapter.
2. Introduction of testing tester and environment :Specifications, characteristic,and surface of wafer testing device will be introduced in this chapter.
3. Testing principle : Testing principle of test items that be programmed
for measuring wafer.
4. Testing recipe programming : Introduce programming process in this
chapter.
5. Testing result : Measurement value and waveform will be introduced in
this chapter.
In the present generation,most of instruments are controlled by IC.And what is the most important part inside IC? It is microchip.The microchip is cut from wafer.Wafer testing is the last defense that ensure the quality of every products.Cause this importance,I chosen “wafer testing” be my report topic.

The testing process of device RK28xx will be interpreted in report. First I introduced specifications and frameworks of tester.Then I explained measurement range that in my program of products.And I also interpret principles for every test items.Final,I explained what testing result mean,and how can I improve it.If I do something that could improve testing result,I will keep a record in this report.Testing result always be effected on factors such as temperature、miscellaneous signal、stability of tester…So,one tough question for testing is recipe programming(Because you need to study different program languages for different tester instrument),the other one is program debugging.What does program debugging mean?I think that find out the fail root cause,and solve the issue by experience and analysis self.The subject of testing can bring me satisfied accomplishments and learning.So I decide topic“Principle of probes and its measurement results for silicon wafers” be my graduate report.

並列關鍵字

wafer ； program ； testing

參考文獻

1. The Fundamentals of Digital Semiconductor Testing

2. Introduction to component Testing

(By Anthony K.Stevens)(May 1999) total page 407

3. Digital Communications

參 考 資 料