高效能電競筆電散熱系統研究

A study on the radiator of high performance gamming note book

楊志偉(Chih-wei Yang)

指導教授 ： 鄧治東 ； 許政行

中原大學/工學院/機械工程研究所/碩士(2015年)

https://doi.org/10.6840/cycu201500184

摘要

P150XM為本文探討P750ZM的前身，CPU搭配 Intel Ivy Bridge Mobile 45-Watt CPU，VGA為Nvidia GTX880 105watt，機身總厚度45 mm，對比P750ZM CPU搭配 Intel Haswell Desk TOP 88-Watt CPU，VGA為Nvidia GTX980 103-Watt，不僅CPU功率高了43-Watt，機身厚度也一舉降低到36 mm，在設計空間受限下，必須更著重於散熱模組及離心式風扇單體的提升以達到系統散熱需求。
本文主要針對實測狀態，離心式風扇由原本同尺寸(808015 mm)直葉流量12 CFM，風壓12.5 mm-H2O，改為直輪葉後在固定轉速條件下，提升到12.6 CFM ，風壓13.3 mm-H2O，系統噪音測試5V+4.5V由49.8 dBA(Max)降到47.8 dBA；散熱模組由原本設計的CPU VGA分離式模組(Pipe D6X3 each)，TAT75% CPU Tj(Junction Temperature) 98度，改為一體式模組(Pipe D6X7)後CPU Tj溫度降低到86度，說明直輪葉型風扇，設計參數較為彈性，能幫助噪音降低且不影響性能，以及一體式的散熱模組設計，能均勻兩邊熱源的散熱，充分運用整體散熱模組的散熱面積，以利薄型化筆電的散熱性能提升，期望未來可供薄型化高階筆電做散熱設計參考。

關鍵字

筆記型電腦 ； 離心式風扇 ； 扇葉葉型 ； 散熱模組 ； Icepak ； 熱管

並列摘要

In this study, P150XM is the predecessor of P750ZM – CPU to go with Intel Ivy bridge Mobile 45-Watt CPU using VGA for Nvidia GTX880 105-Watt, with the whole system thickness of 45 mm, comparing with P750ZM CPU to go with Intel Haswell Desk TOP 88-Watt CPU. Here, VGA uses Nvidia GTX980 103-Watt; because of certain design limitation, not merely CPU work power becomes higher but also the thickness lowers to 36 mm in one revision. The need of improvements on thermal module and single-body fan to better meet the demand for dissipating heat should be emphasized.
The study presented in this thesis aims at the investigation of the field test results with the dimension of fan refined from 808015mm straight-type, 12 CFM air flow and 12.5 mm-H2O pressure to composite-type 12.6 CFM air flow and13.3 mm-H2O pressure, while the system noise test criterion (5V+4.5V) lowered from 49.8 dBA (Max.) to 47.8 dBA. After the thermal module was refined from CPU VGA separated-type thermal module (Pipe D6X3 each) with TAT75% CPU Tj (Junction Temperature) at 98 degree C to integrated-type thermal module; this revision of the thermal module reduced the T j of CPU down to 86 degree C. The results obtained from this study demonstrate that the straight-type fan possesses more flexibility for the design parameters; such flexibility helps lower the noise without much impact on the performance. Furthermore, the design of integrated-type thermal module is able to make a more even dissipation of heat from both sides of the thermal module by fully using the overall area available for heat dissipation.
Using the improved designs of fan and the thermal module, the heat dissipating capability of a ultra-thin notebook computer was proven to be enhanced. It is expected that the results obtained from this study would be used as references for the future design of the heat-dissipating measures for the high-performance ultra-thin notebook computers.

並列關鍵字

Impeller type ； Thermal module ； Centrifugal fan ； Notebook computer ； Heat pipe ； Icepak

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