銲料中微量添加鈷對錫-銅/銀、錫-銅/鎳與錫-銅/銅界面反應之影響

Effects of Minor Co Addition upon Sn-Cu/Ag, Sn-Cu/Ni,and Sn-Cu/Cu Interfacial Reactions

曾彥綸(Yan-Lun Tseng)

指導教授 ： 陳志吉

中原大學/工學院/化學工程研究所/碩士(2013年)

https://doi.org/10.6840/cycu201300605

摘要

在無鉛銲料的發展歷程中，在銲料中添加微量元素是銲料改質，進而改善銲點可靠度之重要手段。在眾多微量添加元素中，鈷由於具有諸多優點，始終是一個有潛力的研究方向。目前文獻上有關銲料中微量添加鈷與電子構裝中各種常見之表面處理層如鎳、銅與銀之界面反應並不完整，本論文針對目前業界常用之共晶Sn-Cu銲料中微量添加鈷，與鎳、銅與銀等基材之界面反應做系統性探討，以作為銲點可靠度評估之依據，鈷添加量範圍為0.01-1wt%。
研究結果顯示，0.01-1wt%Co添加不會改變界面反應生成之介金屬相，但會改變介金屬相之生長速率；鈷的添加細化所生成之Ni3Sn4與Cu6Sn5等介金屬相之晶粒。Sn-0.7wt%Cu-Co/Ni界面反應與Sn-0.7wt%Cu/Ni相似，生成相為Ni3Sn4相與Cu6Sn5相。鈷添加量愈高，界面反應生成相生長速率愈慢。Sn-0.7wt%Cu-Co/Cu界面反應與Sn-0.7wt%Cu/Cu相似，生成相為Cu3Sn相與Cu6Sn5相。與Sn-0.7wt%Cu-Co/Ni界面反應相反，鈷添加量愈高，Sn-0.7wt%Cu-Co/Cu界面反應生成相生長速率變快。由於生成之Ag3Sn相中幾乎沒有鈷的溶解度，銲料中微量添加鈷對銲料與銀基材之界面反應幾乎沒有影響。
本論文決定出共晶Sn-Cu銲料中添加各微量鈷與鎳、銅與銀基材之時效測試動力學參數，此動力學參數是銲點可靠度評估最重要之參考數據。

關鍵字

Co ； 微量添加 ； 界面反應 ； 無鉛銲料

並列摘要

Minor Co addition into the solders is a promising method to improve the solder, and thus the soldering joint properties. However, the complete investigations regarding to the interfacial reactions between Co-alloying solders and the frequently encountered surface finish in electronic packaging industry i.e. Ni, Cu, and Ag are lacking. This thesis investigates the Cu-0.7wt%Cu-xCo/(Ni, Cu, Ag) interfacial reactions, where x ranges from 0.01 to 1wt%, and the Sn-0.7wt%Cu alloy is the commercial eutectic Sn-Cu solder.
In 0.01-1wt%Co additions, Co does not alter the reaction phases but growth rate. Sn-0.7wt%Cu-Co/Ni interfacial reactions are similar to those of Sn-0.7wt%Cu/Ni. The reaction phases are the Ni3Sn4 and Cu6Sn5 phases. However, Co enhances the growth of the Ni3Sn4 phase, and the reaction phase growth is inhibited. Sn-0.7wt%Cu-Co/Cu interfacial reactions are similar to those of Sn-0.7wt%Cu/Cu. The reaction phases are the Cu3Sn and Cu6Sn5 phases. In contrast to those of Sn-0.7wt%Cu-Co/Ni, Sn-0.7wt%Cu-(Co)/Cu interfacial reactions are expedited by Co. In Sn-0.7wt%Cu-Co/Ag reaction couples, the Co effect is negligible because of the negligible solubility of Co in the Ag3Sn phase. Co dissolution refines the grains of the reaction phases.
The kinetics of the Sn-0.7wt%Cu-xCo/(Ni, Cu, Ag) aging tests are determined in this thesis. The aging test kinetics data are essential to the reliability assessments of the soldering joints.

並列關鍵字

lead-free solders ； Minor Co additions ； interfacial reaction

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