摘要 本論文探討Sn-Cu-Fe三元相平衡、Sn/Cu-Fe、Sn-(Fe)-(Mn)/Co與Cu/Sn-0.04wt%Co/Ni反應偶之界面反應。實驗結果顯示純Sn與Cu-xwt%Fe (x=1, 3, 5)基材在250oC之界面反應生成相皆為Cu6Sn5相,隨著Fe的添加量提高,Cu6Sn5相之生長速率減慢。根據相平衡實驗,在250oC下,Sn-Cu-Fe三元系統靠近Sn端為liquid(Sn)-FeSn2-Cu6Sn5的三相區,FeSn2相中Cu的最大溶解度為1.6at%;Fe的最大溶解度為7.3at%。 在Sn中添加0.05wt%Fe、0.05wt%Mn與Co基材之250oC界面反應,其生成相為CoSn3相;在銲料中微量添加Fe與Mn元素可以有效的抑制CoSn3厚度。Cu/Sn-0.04wt%Co/Ni反應偶之180oC界面反應結果顯示,在Cu端生成相為Cu3Sn相與Cu6Sn5相;在Ni端生成Ni3Sn4相。對照Cu/Sn/Ni 反應偶,在銲料中添加0.04wt%Co可以阻擋Cu從Cu基材端擴散至Ni基材端。 關鍵字:Sn-Cu-Fe,Sn/Cu-Fe,Sn-(Fe)-(Mn)/Co
Abstract The purpose of this thesis was to investigate the phase equilibria of the Sn-Cu-Fe ternary system at 250oC near the Sn rich corner and interfacial reactions in Sn/Cu-Fe, Sn-(Fe)-(Mn)/Co and Cu/Sn-0.04wt%Co/Ni couples. Experimental results indicate that the reaction phase in Sn/Cu-xwt%Fe (x=1, 3, 5) couples reacted at 250oC is the Cu6Sn5 phase. The growth rate of the Cu6Sn5 phase is decreased with greater Fe additions. According to the Sn-Cu-Fe ternary phase equilibria experimental results at 250oC, it is a liquid (Sn)-FeSn2-Cu6Sn5 three phase region near the Sn rich corner. The maximum Cu solubility in the FeSn2 phase is 1.6at%, and the maximum Fe solubility in the Cu6Sn5 phase is 7.3at%. The reaction phase in the Sn-0.05wt%Fe/Co and Sn-0.05wt%Mn/Co couples reacted at 250oC is the CoSn3 phase, and their thicknesses of the CoSn3 phase are smaller than that of Sn/Co. Minor Fe and Mn additions in the pure Sn solder can inhibit the reaction rate between the pure Sn solder and the Co substrate. In the Cu/Sn-0.04wt%Co/Ni couple reacted at 180oC, the reaction phases at the Cu side are the Cu3Sn phase and Cu6Sn5phase, and that at the Ni side is the Ni3Sn4 phase. In comparison with Cu/Sn/Ni couples, add 0.04wt%Co in the pure Sn solder can block Cu from the Cu side to the Ni side. Keywords:Sn-Cu-Fe, Sn/Cu-Fe, Sn-(Fe)-(Mn)/Co