- 學位論文
探討膨潤劑對環氧樹脂去膠渣行為之影響
Effects of Sweller on the Removal of Smear from the Epoxy Resin
摘要
摘要 目前電子產品趨向多功能性的趨勢發展，使得印刷電路板的線路必須採取多層化的使用，一般是以樹脂的複合材料作為介電層，為了清除在鑽孔後所形成的樹脂膠渣，避免影響鍍銅的品質，所以進行去膠渣步驟來加以去除。因為膨潤劑會幫助氧化劑咬蝕膠渣，所以工業界一般利用膨潤劑作為氧化劑咬蝕的前處理，以提升去膠渣的效率。因此為了達到最好的咬蝕效率，並降低膨潤劑的使用成本，選擇適合的膨潤劑濃度、溫度與操作時間是目前研究上的重要課題。本研究內容分為三部份：(1) 探討環氧樹脂對膨潤劑的吸收行為，(2) 探討膨潤劑吸收量對樹脂咬蝕量的關係，(3) 觀測環氧樹脂在浸泡膨潤劑後，表面性質之變化。 本研究利用電子微量天平測量樹脂的重量增加，觀察環氧樹脂對膨潤劑吸收量的關係，膨潤劑實驗條件：溫度範圍在313.2~353.2 K，濃度範圍在50, 75, 100 vol% Solvent-II，時間範圍在0~3 hr，藉由Fick’s second law來推算擴散係數D 。利用D與溫度的關係藉由Arrhenius equation計算出在濃度50, 75, 100 vol% Solvent-II ，Ea分別為112, 115, 125 (kJ• mol-1)，D0 分別為35, 1706, 319571 (10-9• cm2• min-1)。 本研究觀測環氧樹脂在浸泡氧化劑後，測量樹脂之重量損失量，來作為評斷咬蝕效果之方法。氧化咬蝕實驗條件：溫度範圍在313.2, 333.2, 353.2 K，濃度範圍在50, 75, 100 vol% Solvent-II，時間範圍在5 min，浸泡氧化劑10 min。實驗結果證實，樹脂經由膨潤劑的前處理，選擇膨潤劑在75 vol% Solvent-II, 353.2 K, 2 min，即可達最大咬蝕量0.42 mg• cm-2且為最省成本的操作條件。另外，利用傅立葉轉換紅外線光譜儀 (ATR-FTIR) 與接觸角量測儀來進行觀測，發現樹脂會受到膨潤劑的影響，表面性質由疏水性變成較親水性，因此氧化劑變得較容易進入樹脂，進而提高咬蝕效果。
並列摘要
Abstract The demand trend for multifunctional electronic products has led to the development of multilayered printed circuit boards using glass-fiber reinforced epoxy resin as the substrate of insulating material. Holes are drilled through these boards and the drilling leaves a smear of insulating material on conductive surface which needs to be removed prior to deposition of conductive material. The industrial practice of desmearing utilizes a sweller prior to oxidation of the smearing material. Because the amount of sweller absorbed will affect the outcome of oxidation, it is necessary to select the appropriate sweller concentration, operating time and temperature to maximize oxidation with the aim of lowering the operating costs. This study consists of three parts: (1) Determine the effect of using sweller on epoxy surface properties. By changing the surface to become more hydrophilic, it made easier the transport of the oxidizer in the resin and thus enhanced oxidation. (2) Investigate the absorption of sweller by epoxy resin. Using Arrhenius equation to relate diffusion coefficients with temperatures, the study obtained Ea to be 112, 115 and 125 (kJ• mol-1) and D0 to be 35, 1706, 319571 (10-9• cm2• min-1) for sweller concentration of 50, 75, 100 vol% of Solvent-II. (3) Investigate the relationship between the amount sweller absorbed and epoxy removed. It was found that optimum weight loss is obtained from using sweller concentration 75 vol% of Solvent-II at 353.2 K and for 2 minutes.