合成與改質聚醯亞胺環氧樹脂之性質分析

電子產品在體積越來越小、運算速度越來越快的情形下，必定造成發熱密度越來越高的情形，其所產生的熱如無法適時排出，將使IC元件因溫度過高而影響到產品的可靠性並造成使用壽命的減低，因此基板的材料選用就成為很重要的方向。良好的基板必須具備高熱穩定性、高耐熱性。材料的耐熱性通常可以用玻璃轉移溫度（Tg）來表示，Tg越高表示材料耐熱性越佳。以環氧樹脂為主的PCB基板其Tg大約在180℃左右，雖然已經可以稱作是耐熱性基板，但是要作為高耐熱基板，Tg值仍稍低，Tg值大約＞210℃以上方可稱作高耐熱基板材料。而聚醯亞胺雖有極高的耐熱性，但是加工性及相溶性不佳，為改善聚醯亞胺成形加工性，所以本研究利用環氧樹脂與聚醯亞胺合成出可溶於非質子溶劑的聚醯亞胺環氧樹脂與可交聯的改質聚醯亞胺環氧樹脂，可以改善聚醯亞胺的加工性、相溶性。結果顯示改質聚醯亞胺環氧樹脂經熱交聯後，由DSC分析玻璃轉移溫度（Tg）最高達219.8℃，由TGA分析Td,5%最高為406℃且IPDT值最高為2088.8℃，已達到作為高耐熱基板材料所需Tg值＞210℃以上之需求。

關鍵字

環氧樹脂；聚醯亞胺

並列摘要

With increasingly calculation speed and reduced product’s valume, the density of the heat generated will increase and must be dissipated to the environment effectively. Otherwise, the junction temperature of the IC device will increase and the reliability as well as lifetime of the IC device will decay. According to those applications, the material selection of the substrate will be very critical. The usable materials in the electronic industry must meet the higher requirements of thermal stability and resistance. The higher glass transition temperature (Tg) of substrate represent that the property of the thermal stability is better. In general, the Tg of the substrate of printed circuited board made by epoxy resin is only up to 180℃, but the Tg of substrate called high thermal stability must be higher than 210℃. Furthermore, aromatic polyimide（PI）is well known as polymer materials of high performance for their excellent thermal stability, but it has poor processability, solubility unsavoriness. In this research, the poly(imide-epoxy)s（PIE）and modified poly(imide-epoxy)s（MPIE）resins, that exhibit good solubility in nonprotonic solvent, good processability, can be made. The results of the cured MPIE resins show that the glass transition temperature reachs to 219.8℃ by Differential Scanning Calorimeter, the temperature of decomposition at 5% is up to 406℃ by Thermogravimetric Analyzer, and integral procedure decomposition temperature is equal to 2088.8℃.

並列關鍵字

epoxy ； polyimide

參考文獻

4.陳鼎龍, 碩士論文, “可溶性即可交聯性含氟聚醯亞胺之合成與性質之研究”, 中原大學化工系, 2001.

5.高正杰, 碩士論文, “探討苯均四酸二酐系列之聚醯亞胺應用在積體電路製成的研究”, 中原大學化工系, 2003.

6. M. Kosuke, E. Kazuya, S. Yuji, U. Mitsuru, G. Kenichi, T. Souji, “New positive-type photosensitive polyimide having sulfo groups”, Polym, 2003, 44, 6235-6239.

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合成與改質聚醯亞胺環氧樹脂之性質分析

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