銅薄膜奈米機械性質之分析與測試

Analysis and Test for Nano-Mechanical Properties of Thin Copper Film

黃治綱(Chih-Kang Huang)

指導教授 ： 張永鵬 ； 康淵

中原大學/工學院/機械工程學系/碩士(2007年)

https://doi.org/10.6840/cycu200700809

摘要

本文以奈米壓入試驗，探討銅薄膜的機械性質以及潛變現象的發生原因，並使用有限元素法模擬單晶銅塊材與多晶銅薄膜於奈米壓入之力學特性，以奈米壓痕試驗驗證，探討單晶銅塊材與多晶銅薄膜的變形及應力之材料力學性質。
銅材料以濺鍍方式成長為多晶薄膜，以單一壓入模式與重複壓入模式對銅薄膜進行奈米壓入試驗，由於差排效應產生應變硬化現象，其潛變應變因壓入次數與壓入深度增加而減小，潛變深度也隨著持重時間增加而減小；並將奈米壓入試驗中的壓力對深度曲線，與有限元素分析的變形曲線進行比對，得到吻合實驗的分析模型，以及擬合材料之降伏應力。

關鍵字

奈米壓痕試驗 ； 潛變現象 ； 銅薄膜 ； 有限元素法

並列摘要

This thesis presents an experimental result for mechanical properties and creep phenomenon on thin copper film by the use of nanoindentaton test. Also determines the mechanical properties of single crystal copper bulk and polycrystal thin copper film by finite element simulations applied on nano indentation test.
Copper material is to crystallized to be thin copper film with polycrystalline by sputtering. In indentation test, single-indent mode and multi-indent mode are used to discuss creep phenomenon which caused by strain hardening because of dislocations in thin copper film. The creep strain decreases with the increasing of the number of indents and the depth of indentation, in addition, the creep depth decreases with the increasing of holding time. Finite element simulation is used to simulate a load-depth curve done by nanoindentation test, and to find the ideal yield strength of thin copper film via experiment curves.

並列關鍵字

nanoindentation ； creep ； thin copper film ； FEM

參考文獻

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