金錫凸塊於LED元件封裝：熱應力與機械應力特性探討

焊料是電子封裝技術失效的關鍵材料，焊料接合性質及組成選用是非常重要的，其介金屬化合物生成與合金層焊料的可焊性是電子封裝接合的關鍵要素。金錫(Au-20Sn)共晶焊料是金基貴金屬焊料，其有抗氧化性高，潤濕性好等優勢，具備高可靠度與高溫應用等特性，近來越來越被廣泛應用在微電子（特別是覆晶封裝晶片），微機電系統，光學晶片，LED，射頻設備，以及用於商業，工業，軍事用途，和電信等相關應用。在焊熔過程中，因合金的共晶成分比例，很微小的過熱度就可以使其合金熔化並浸潤；另外，合金的凝固過程時間也非常快。因此，金錫合金的應用能夠大幅減短整個金的凝固過程進行得也很快。金錫合金的使用能夠大大縮短整個釬焊過程週期製程時間。金錫合金的金的凝固時間過程快。金錫合金的使用能夠大大縮短整個軟焊過程週期溫度範圍適用於對穩定性要求很高的電子元件組裝上。同時，這些元件也能夠承受隨後在相對低一些的溫度利用無鉛焊料的組裝。這些焊料的組裝溫度大約在 280°C。本研究介紹金錫焊料的基本物理性質及其在銅柱上微電子、封裝中的應用，並針對金錫焊料應用於銅基板LED可靠度研究，探討(1)不同組成金錫焊料應用在銅柱上可靠度；(2)經可靠度實驗後觀察介金屬化合物的生成與焊料硬度變化。

關鍵字

金錫；可靠度

並列摘要

Solder, a key material in failure of electronic packaging, was important in bonding properties and composition of ingredient. The growth and weldability of intermetallic compound (IMC) were crux in electronic packaging when it was stick together. Au-20Sn, a kind of gold based solders, has a number of advantages, such as good oxidation resistance, fine wettability and superior reliability. Recently, the solder more and more was used in flip-chip of microelectronic packaging, micro-electromechanical systems (MEMS), LED and so on. Low temperature will make solder melt because it have eutectic point when it is welding. Otherwise, to apply Au-Sn solder will shorten time which the cycles of welding process because melting and curing of solder is so fast. To use Au-Sn solder will be stable on electric parts. This research study properties and reliability of Au-Sn: (1) RA when Au-Sn on Cu pillar bump, (2) IMC, hardness and stress of Au-Sn after RA.

並列關鍵字

Au-Sn ； Reliability

參考文獻

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金錫凸塊於LED元件封裝：熱應力與機械應力特性探討

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