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  • 學位論文

具寬頻帶與阻抗匹配之新型蛇狀平行微帶線遠端串音雜訊之抑制

Reduction in Far-end Crosstalk Noise for New Serpentine Parallel Microstrip Lines with Broadband and Matched Impedance

指導教授 : 薛光華
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摘要


近年來隨著高速數位化通訊時代的來臨,高頻化電子產品、電腦高速訊號硬體和軟體的快速發展以及工作頻率增加與頻寬要求變高與積體電路快速發展,因此對於數位訊號的工作頻率與頻寬要求也越來越高。當高速數位信號傳輸受到速度的提升,再加上互連元件產品如連接器、線纜或印刷電路板縮小化使電路的佈局越來越緊密,造成訊號完整性(Signal Integrity, SI)、電磁干擾(Electromagnetic Interference, EMI)、電磁相容(Electromagnetic Compatibility, EMC)或是電源完整性(Power Integrity, PI)等問題,因此這樣的議題逐漸被重視。 在微帶線結構中即使是有一定間距的單根傳輸線也可能因為傳輸線的長度太長而導致有遠端串音雜訊的累積,遠端串音雜訊會影響到訊號傳輸的完整性,所以本論文針對遠端串音抑制結構做模擬分析。 本論文探討微帶線結構使用蛇狀繞線結構來減少遠端串音雜訊,透過增加互容使電容耦合比等於電感耦合比來消除遠端串音雜訊,但是舊型的蛇狀結構的抑制率不夠強大,因此本論文提出了兩種新型的蛇狀結構不僅提升了遠端串音雜訊的抑制率並可以使阻抗匹配且有效頻寬也更大。

關鍵字

遠端串音雜訊

並列摘要


In the recent years, As the clock frequencies and data transmission rates in semiconductor systems steadily increase beyond the GHz range, the timing control of high-speed clocks and digital data, propagating signal traces on printed circuit boards(PCB), is becoming a critical issue in a high-speed digital circuit design. In high-speed data links, cables and connectors are required to transmit high speed signals between the various electronic devices or PCBs. This may cause SI(signal integrity)、electromagnetic interference (EMI) 、Electromagnetic Compatibility,(EMC) and power integrity, and other effects. Hence, during the design of state-of-the-art electronic systems, reducing the noise induced by trace is crucial. In the microstrip line structure, even a single transmission line with a certain distance also possible cause the accumulation of far-end crosstalk noise because the length of the transmission line is too long, and the far-end crosstalk noise affects the signal integrity. So this paper does simulation analysis for the far-end crosstalk suppression structure. This paper discusses the microstrip line structure using a serpentine structure to reduce the far-end crosstalk noise, by increasing the mutual capacitance so that the capacitive coupling ratio equal to the inductive coupling ratio to eliminate the far-end crosstalk noise, but the old serpentine structure suppression rate is not strong enough, so this paper proposes that the two new serpentine structures not only increase the suppression rate of the far-end crosstalk noise but also can make the impedance matching and the effective bandwidth is more wider.

並列關鍵字

Far-end Crosstalk Noise

參考文獻


[1] Kyoungho Lee, Hae-Kang Jung, “Serpentine Microstrip Lines With Zero Far-End Crosstalk for Parallel High-Speed DRAM Interfaces,” in IEEE Transactions on Advanced Packaging, vol. 33, no. 2, pp. 552-558, May 2010
[2] K. Lee et al., “A serpentine guard trace to reduce the far-end crosstalk voltage and the crosstalk induced timing jitter of parallel microstrip lines,” IEEE Trans. Adv. Packag., vol. 31, no. 4, pp. 809–817, Nov. 2008.
[3] Y. S. Sohn et al., “Empirical equations on electrical parameters of coupled microstrip lines for crosstalk estimation in printed circuit board,” IEEE Trans. Adv. Packag., vol. 24, no. 4, pp. 521–527, Nov. 2001.
[4] S. K. Lee et al., “FEXT-eliminated stub-alternated microstrip line for multi-gigabit/second parallel links,” Electron. Lett., vol. 44, no. 4, pp. 272–273, Feb. 2008.
[5] I. Novak, B. Eged, and L. Hatvani, “Measurement by vector-network analyzer and simulation of crosstalk reduction on printed circuit boards with additional center traces,” in Instrum. Measurement Technol. Control Conf., Irvine, CA, May 1993, pp. 269–274.

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