鎳鈷電鍍邊緣效應改善

The improvement of the edge effect on Ni-Co electroplating

蔡明昌(Tsai Ming Chang)

指導教授 ： 張耀仁

中原大學/工學院/機械工程研究所/碩士(2017年)

https://doi.org/10.6840/cycu201700684

摘要

電鍍過程中由於有電流場邊緣效應現象，電流場中心與邊緣的電流阻力不同，造成電鍍膜厚不均勻，尤其邊緣處的厚度相對中心處厚，隨著電鍍面積越大，邊緣效應越嚴重，考慮以電化學方式鍍鎳鈷有其困難性，附著力容易不足，且膜層容易剝落的特性，本研究選擇以電鍍鎳鈷條件進行實驗，規劃於陽極與陰極間加入一個與鍍件形狀相似的隔板，藉以改變電流分佈的現象，利用田口實驗方法進行系統參數最佳化的設計，採用影響品質特性的四個控制因子(Factors)，分別是陰極與隔板間距離、隔板厚度、隔板內部開口大小及陽極與陰極間的距離，各個因子皆有三個水準(Levels)，選用L9(34)直交表規劃實驗，再依照整理過後的數據，分析每一個控制因子的靈敏度與重要性。
實驗結果表示，未加隔板時電鍍膜厚的厚度差為10um，而加入隔板後的膜厚厚度差可達到約4um，膜厚差改善約60%。

關鍵字

電鍍；田口實驗；膜厚不均勻

並列摘要

During the electroplating process, the distribution of the current field is not uniform. The current resistance at the center of the current field is different from that at the edge, leading to uneven thickness of the coating. Especially, the thickness at the edge is thicker than that at the center. With the larger plating area, the more serious the edge effect. Due to the difficulty of Ni-Co electroplating, the film adhesion is insufficient and easy to peel off. In this study, Ni-Co plating was chosen for experiments. The main plan is to add a separator between the anode and the cathode, to change the phenomenon of current distribution. Using Taguchi experimental method to optimize system parameters. Four control factors, including the distance between the cathode and the separator, the thickness of the separator, the opening size of the separator, and the distance between the anode and the cathode, were chosen to conduct the experiments. These four control factors affect the quality characteristics of the electroplating. Each factor was designed to have three levels. We use the L9(34) orthogonal table to plan the experiment, and then analyzed the sensitivity and importance of each control factor according to the experimental data.
The experimental results showed that the difference on the thickness of the plated film was 10 μm when the separator was not added, while the the difference on the thickness was improved to be only 4 μm with the addition of the separator.

並列關鍵字

Electroplating；Taguchi Method；Uniformity

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