覆晶基板熱變形與表面形貌之線上檢測

In-line Monitoring of Thermal Deformation and Surface Topography of Flip Chip Substrates

蔡維恩(Wei-En Tsai)

指導教授 ： 章明

中原大學/工學院/機械工程研究所/碩士(2011年)

https://doi.org/10.6840/cycu201101057

摘要

本研究結合數位影像相關法與投射條紋法，發展一套可用於製程線上同時量測物體面內及面外變形與三維形貌的檢測系統。此系統係利用CCD擷取物體受力過程中的影像，以 DIC技術比對受力前後之影像可得到表面各點面內位移量，同步以投射條紋技術應用傅立葉轉換求得各點相位，經由光學三角法即可得到物體的表面形貌，並可進一步得到物體全域的面外位移量。本文將覆晶基板加熱變形進行量測，由結果得知覆晶基板在加熱至150℃後，面內變形的最大變形量為63.1μm，表面形貌的中心點之上升了160.6μm，面外的位移量為158.5μm。經由精度驗證後證實本系統在量測微米變形量的物體有良好的成果，且量測可於數秒內完成，預估本系統可達到工業生產的翹曲變形線上檢測需求。

關鍵字

投射疊紋法 ； 基板 ； 數位影像相關性 ； 覆晶封裝

並列摘要

In the manufacturing process of flip chip packaging, the IC chip would be subjected to a temperature increase to roughly 150C. With the rise of temperature, the chip is induced to a series of deformations which lead to possible malfunction of the IC unit. Therefore, the investigation of in-line thermal deformation of the flip chip substrates in chip packaging process is important. In this study the thermal deformation and surface profile of flip chip substrates under thermal stress are simultaneously measured with a system composed of digital image correlation (DIC) and projection fringe techniques. DIC technique is implemented to measure the in-plane deformation distribution and strain tendencies of flip chip substrates while projection fringe method is used to grab the out-of-plane deformation and surface profile of the substrates. Experimental results show that the warpage effect of the substrates is obvious when subjected to thermal loading. Since the measurement system is very easy to be implemented, this combination of DIC and projection fringe technologies maybe one of the most possible techniques for the growing need of in-line thermal deformation monitoring in the production line of flip-chip packaging.

並列關鍵字

substrate ； flip chip packaging ； digital image correlation ； projection fringe

參考文獻

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