以非接觸式方法提昇TFT-LCD加壓封止製程之基板施壓均勻度

對於 TFT-LCD 加壓封口製程，傳統使用接觸加壓的方式，容易造成壓力不均勻，本文提出之非接觸方法，除了解決壓力不均勻的問題，提高良率外，改良之清除液晶及封口膠塗膠的方法，在批量生產時，更可大幅縮短批量的生產時間。本文簡述 TFT-LCD 的製造流程，並針對加壓封口製造流程做詳細的介紹。對於傳統接觸方法加壓封口製程造成的壓力不均勻之成因，以及其對色彩的影響，我們有一些探討。針對傳統接觸式加壓封口所造成的問題，本文提出非接觸方法加壓封口製程的替代方案，除了詳細介紹其原理，製程，以及設備之外，我們也用生產線上的設備，以及樣品，實際試驗非接觸方法加壓封口製程的良率，並研究其故障模式及改良方案。經實際試驗之統計分析驗證得知： (1) 非接觸方法較接觸方法，其製程管制項目中液晶層厚度(Cell gap)不良發生率減少 98%。吸入量不良發生率減少 100%。 (2) 使用非接觸式方法，成功的達成降低加壓封口不良率 3% 的目的，其經濟效益為 13.5 億/年。 (3) 非接觸式方法在批量生產時時間，由傳統接觸式108分鐘減少為 65分鐘，大幅縮短生產時間45%。綜合以上三點說明，在降低不良發生率及提升經濟性、生產效率等等項目，非接觸式方法在 TFT-LCD 之加壓封口製程中有顯著貢獻。

關鍵字

接觸；非接觸；吸入量；液晶層厚度

並列摘要

Traditional methods in TFT-LCD sealing process compress the gap between the color filter and the TFT with contact means which results non-homogeneous over the panel plane. With non-contact approach, this dissertation studies a new method that not only increases the yield rate but also improves the throughput. In this dissertation, we describe the TFT-LCD production processes with emphasizing on sealing process. We study the cause of the gap non-homogeneity, and how the non-homogeneity affects the color that the TFT-LCD show off. A non-contact approach is used to replace the traditional contact method in this research. Besides the discussion of the theorem, the process, and the equipments, we put real TFT-LCD samples into real production line to study the yield rate of non-contact approach. Whenever there is NG result, we analysis the failure mode, find the cause, and than improves the process. The experimental results tell us, (1) Compared to the traditional contact approach, the non-contact approach improves the cell gap failure by 85%, the glue sucking failure by 100%. (2) With non-contact approach, failure rate of sealing process is suppressed into 3%, the goad of this project. The commercial benefit is 1.35 billion NTD per year. (3) 108 minutes per batch in traditional approach is squeezed to 65 minutes per batch, which is 45% improvement in throughput. Concludes the above three points, the non contact approach contributes in yield rate, throughput and efficiency.