光照射對無電鍍銅影響之研究

A study of the influence of light for electroless copper plating

林彥呈(Yen-Cheng Lin)

指導教授 ： 黃振忠

中原大學/理學院/應用物理研究所/碩士(2006年)

https://doi.org/10.6840/cycu200600189

摘要

我們使用各種波長照射來觀察對無電電鍍的影響，並明確的由實驗決定出截止波長為390nm，超過390nm即不會對鍍析造成影響。
照射短於390nm的光可以改變無電電鍍的鍍析速率，控制照射能量的多寡，則可以得到負像或正像的鍍析。
利用短於390nm的光對無電電鍍之鍍析速度的改變，配合光罩之使用，可以鍍析出線路圖形，不管是加成法或減成法，也許比蝕刻製成電路來的經濟。

關鍵字

無電鍍銅

並列摘要

The effects of irradiation light with several wavelengths on electroless plating were studied . The cut-off wavelength was found to be 390nm . No effect was observed if the wavelength longer than 390nm .
The electroless plating speed of metal deposition on the substrate varied with the light wavelengths below 390nm . By adjusting the amount of irradiating energy to the substrate , the positive or negative images could be formed accordingly .
Potentially , the electronic circuits can be electroless plated out on a substrate by taking advantage of ultraviolet irradiation and mask design . Since this technique is an additive process , electroless plating may offer a way that costs less for making the printed-circuit boards , as opposed to the conventional , subtractive etching technology .

並列關鍵字

electroless copper plating

參考文獻

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resistance of electroless Ni-P based alloys” , Materials