半導體封裝製程之銀膠厚度與晶片傾斜度檢測

Measurements of Bond-line Thickness and Die Tilt in The Die Attach for Semiconductor Packaging Process

曾凱銘(Kai-Ming Tseng)

指導教授 ： 章明

中原大學/工學院/機械工程學系/碩士(2006年)

https://doi.org/10.6840/cycu200600465

摘要

摘要
由於半導體製程與封裝技術的進步，相對的線上檢測技術需求也日與俱增，其中以黏晶製程與覆晶封裝檢測技術逐漸成為主流。覆晶有別於以往透過打線的互連模式，採用焊料或銀膠進行連結；由於銀膠充填時厚度參數會影響晶片封裝時的可靠度，因此本研究主要目的為建立一套銀膠厚度與晶片傾斜度之檢測系統。

本研究以線雷射掃描技術與空間對映函式法，採用傳統CCD攝影機進行快速、高解析度數據擷取，據以執行半導體封裝之銀膠厚度與晶片傾斜度等參數之量測。實驗時所使用之覆晶封裝樣品的晶片尺寸為15mm×15mm，從基板至晶片頂端之高度約為800~900μm，其中晶片厚度已知為800μm，結合基板與晶片的銀膠厚度大約為50~100μm，實驗結果顯示目前的系統量測解析度為3.47μm。

雖然本研究係以黏晶與覆晶封裝之銀膠檢測為目的，並以多功能、線上檢測以及低成本檢測設備研製為主要目標，但對於其他類似之半導體元件線上檢測需求而言，本系統亦能提供相同的檢測功能。

關鍵字

覆晶封裝 ； 空間對映函式法 ； 銀膠厚度 ； 黏晶

並列摘要

ABSTRACT
Due to the progress of the semiconductor industry and packaging technology, the demand of the on-line inspection system is also expanding. The mainstream technology in inspections focuses around die attach and Flip-Chip packaging. Using soldering or conductive adhesive, the manufacturing process of Flip-Chip deviates from standard wire conjoint module. The reliability of the chip is also affected due to the bond-line thickness. Thus, this paper focuses upon building the measurement system of bond-line thickness and die tilt.
Using traditional CCD to scan the object at high speeds and resolution by way of laser line scanning technology and coordinate mapping, the bond-line thickness and die tilt can be examined. Here the sample size is 15mm×15mm and the height is approximate 800~900μm from the substrate to die top interface. The known thickness of the dies is 800μm, with the bond-line thickness approximating 50~100μm. Examination results currently show the system resolution is 3.47μm.
This study targets the bond-line thickness of the die attach and Flip-Chip packaging, focusing upon online measurement systems and cost-efficient equipment; yet is also able to provide test results on other measurements such as online inspection of semiconductor components.

並列關鍵字

Flip-Chip packaging ； Die attach ； Coordinate mapping ； Bond-line thickness

參考文獻

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