投射疊紋掃描量測技術研究

A study of projection scanning moiré topography

李元裕(Yuan-Yu Li)

指導教授 ： 章明

中原大學/工學院/機械工程研究所/碩士(2001年)

https://doi.org/10.6840/cycu200100157

摘要

本研究提出一種新穎的物體外型輪廓量測方法，此法以傳統的投射疊紋法(projection moiré)結合線CCD掃描擷取影像的技術，獲得以等高線型態展示的條紋圖，配合多線CCD相位分析的技術，即可得知物體的外型輪廓資料。本研究亦針對量測系統提出一完整的校正方式，可有效的提升量測精度，經對一高度0.5mm的標準試件進行量測比對，實驗結果顯示其量測精度可達微米級以上。量測時所採用的影像解析度皆為640*480像素，當量測範圍為6.4*4.8mm時，其橫向解析度為10mm，縱向解析度可達0.2μm以上。整合本研究的成果，此技術將可提供微機電與半導體元件之製程線上外型輪廓檢測使用。

關鍵字

相位量測技術 ； 疊紋測量學 ； 線CCD ； 投射疊紋法

並列摘要

A novel and efficient moiré topography technique with high accuracy is presented. In this technique , a straight-line grating is projected on a translational object and the image of the grating is grabbed and integrated with a line CCD. This transfers the projected straight-line grating to a surface contour of the specimen. The contour map was quantitatively analyzed using phase measuring technique via a multi-line CCD. A process for the calibration of measurement system is proposed. Experimental results show that the measurement resolution can reach to the order of sub-micrometer. This offers a possibility for this technique to be applied to automated full-field profile measurement of the components used in MEMS and the IC industry.

並列關鍵字

lin CCD ； moiré topography ； projection grating ； phase measuring technique

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