藍寶石基板表面輪廓量測系統

Sapphire Substrate Surface Profile Measurement System

謝佳玶(Chia-Ping Hsieh)

指導教授 ： 章明

中原大學/工學院/機械工程研究所/碩士(2013年)

https://doi.org/10.6840/cycu201301004

摘要

本研究針對目前LED產業與半導體產業高解析度與高速度檢測需求，以投射疊紋輪廓量測技術搭配線性馬達高速掃描設計，以數位光源投射系統(DLP)投射光柵，結合高畫素彩色線型CCD，開發出一套國內需求甚高應用於藍寶石基板表面輪廓與翹曲變形檢測的光學檢視雛型機，以提供國內相關業者檢測與研發需求。是以傳統的投射條紋法結合線CCD掃描擷取影像的技術，獲得以等高線型態展示的條紋圖，配合相移干涉量測技術，即可得知物體的外型輪廓資料，解析度可達次微米。目前架構設定相機擷取之條紋間距為22.5μm，實驗結果顯示量測藍寶石基板的測量精度與重複度已可達到次微米級。由於所研製之系統適合於以輸送帶方式傳送之元件的線上量測應用。

關鍵字

線上檢測 ； 表面形貌 ； 彩色線性CCD ； 相移干涉術 ； DLP

並列摘要

On-line surface profile measurement is very important and practical in the LED industry and semiconductor industry. It has stricter specification of high-speed and high-solution to those components than other parts. In this study, a prototype of visual system utilizing the projected fringe topography technique via a color linear CCD camera has been developed for sapphire substrates surface profile inspection. In this system, a straight-line grating is projected using a digital light processing (DLP) onto a transnational object and the image of the grating is grabbed and integrated with a single-line CCD. This transfers the projected straight-line grating to a surface contour of the specimen. The contour map can be quantitatively analyzed using phase measuring technique via the RGB lines of the CCD. The current projected pitch of the grating on the CCD is 22.5. Experimental results show that the measurement accuracy can reach micrometer order with repeatability in the sub-micrometer order. Since the measurement is executed on a translating object, it may be the best choice for on-line or in-process automated inspection for products conveyed by a transporting mechanism.

並列關鍵字

color line CCD ； surface topography ； In-line inspection ； DLP ； phase shifting

參考文獻

23. 李元裕,投射疊紋掃描量測技術研究, 私立中原大學機械工程研究所碩士論文, 2001.

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