抑制多層印刷電路板貫穿孔訊號連通柱接地彈跳雜訊之接地連通柱設計

Ground Via Design for Suppressing Ground Bounce Noise Caused by Plated Through-Hole Signal Via in Multilayer PCBs

莊竣傑(Chun-Chieh Chuang)

指導教授 ： 薛光華

中原大學/電機資訊學院/電子工程研究所/碩士(2019年)

https://doi.org/10.6840/cycu201900414

摘要

隨著高速數位時代不斷進步，電子產品電路系統的工作頻率越來越高頻，訊號的傳輸速度也越來越快，高速數位訊號傳輸過程會造成訊號完整性（Signal Integrity, SI）、電源完整性（Power Integrity, PI）、電磁干擾（Electromagnetic Interference, EMI）或是電磁相容（Electromagnetic Compatibility, EMC）等問題，因此對於印刷電路板（Printed circuit board, PCB）上相關議題的解析將越趨重要。
本篇論文將會針對訊號線穿層所引發的接地彈跳雜訊（Ground Bounce Noise, GBN）進行探討。厚層印刷電路板（PCB）中有許多的貫穿孔連通柱（Via），層與層之間的傳輸線、接地平面和電源平面經常利用連通柱連接，當電的訊號通過連通柱時，接地層以及電源層等兩金屬平面之間會產生暫態電壓，而此雜訊電壓即為接地彈跳雜訊（GBN），當電子系統受到雜訊干擾，容易使電壓位準誤判造成訊號完整性的問題。本篇論文分析訊號連通柱所產生的接地彈跳雜訊生成機制，再透過接地連通柱結構有效抑制接地彈跳雜訊的傳播，並進一步設計接地連通柱與訊號連通柱的相對關係，降低接地彈跳雜訊對其他傳輸線的干擾。

關鍵字

接地彈跳雜訊 ； 接地連通柱 ； 訊號連通柱

並列摘要

With the advancement of the high-speed digital era, the operating frequency of electronic product circuits is getting more and more high frequency and the transmission speed of the signal is also getting faster. The process of high-speed digital signal transmission will cause signal integrity (SI), power integrity (PI), electromagnetic interference(EMI), electromagnetic compatibility (EMC), and so on. Therefore, the analysis of related issues on printed circuit board (PCB) will become more and more important.
This paper discusses the ground bounce noise (GBN) caused by signal line through different layers. There are many through-hole vias in PCB, and transmission lines, ground planes and power planes between layers are often connected by vias. When the electrical signal passes through vias, transient voltage is generated between two metal planes such as ground planes and power planes. The noise voltage is the ground bounce noise (GBN). When the electronic system is disturbed by noise, it is easy to make voltage level misjudgment cause signal integrity. This paper analyzes the GBN generation mechanism by signal via. Through the ground via, the propagation of GBN is effectively suppressed. Then design the relative position between ground via and signal via, reduce the interference of GBN on other transmission lines.

並列關鍵字

Ground Bounce Noise ； Ground Via ； Signal Via

參考文獻

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