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  • 學位論文

電路板收放板設備模組化應用

Modular application of Printed Circuit Board Unload/Load equipment

指導教授 : 丁鏞

摘要


本研究是探討如何將電路板(PCB)設備的機構予以適當地模組化。從現有PCB設備之產品中找出相同的功能機構模組,並依客戶經常訂製之各種可能之設備需求予以剖析並與現有之機構模組進行配對。而配對成功之機構模組具共用性,如此僅需針對非共用性及客戶的特殊需求開發,而有助於產品之開發且降低成本。亦即可以縮短設備的開發時間,滿足客戶端不同而多樣的產品需求,而此模組化方式特別適合少量多樣的產品開發。 本研究主要是參考Kamrani所提出的方法,模組系統架構是由各自獨立的模組單元組成,根據各種產品差異來訂定各模組單元,並導入實例研究,探討產品機構模組化設計在產品開發及銷售的過程中,所實行的方法和驗證。經本研究結果顯示,在產品的行銷、設計開發、模組化的共用性、產品的多樣化等方面,皆有明顯的改善。

並列摘要


How to modularize the mechanism of PCB manufacturing equipment is investigated in this article. According to the present already built PCB equipment, an attempt is to search for the mechanism modules of common use. In reference to the various requirement of the PCB equipment from the majority of customers, matching with the assigned modules is carried out. By using the matched modular mechanisms, the unmatched mechanism is the only effort needs further design. Thus, it is instrumental and cost-effective to satisfy miscellaneous demands of the customers. In other words, reduction of development time period and convenience for rare but manifold equipment needs is achieved. Such a modular design is in particular suitable for special design of customer order. Using the Kamrani’s method, the modular system is constructed with a number of independent modularity units. Each modularity unit is defined with apparent difference from other modularity unit. With practical examples of PCB equipment, modularity units are built based on the varieties of equipment feature. Investigation and evaluation is carried out on the modular design method in the process of product development and marketing sales. Through the case study, it verifies with good improvement of the product sales, design process, common-in-use module, and manifold products, etc. The research works out the practical result showing out the improvements in.

參考文獻


[5] Sanchez R. and Mahoney, J. T., ”Modularity, Flexibility, and Management in Product and Organization Design,” Strategic Management Journal,17, pp. 353~370, 1996.
[7] Chakravatry A. K. and N. Balakrishnan, ”Achieving product variety through optimal choice of module variations”, pp.587~598, 2001.
[8] Kamrani A. K., ”Product Design for Modularity”, Boston Kluwer Academic Publishers, 2000.
[1] 林定皓,”印刷電路板簡介-入門篇”, 全華圖書2007。
[2] 呂廣英,”簡介模組化設計與應用”, 機械月刊117 期, pp. 121~125, 1985。

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