- 學位論文
散熱座的材質與形狀對高功率LED嵌燈散熱效果之研究
The Effect of the Heat Dissipation Efficiency of the LED Lamps due to the Shape and Material of the Heat Slug
摘要
本研究之目的在於利用數值模擬軟體進行高功率LED嵌燈模組的分析研究，並搭配實驗量測之數據，在可接受的誤差範圍內進行模組的參數設計與分析。 本文所研究的高功率LED嵌燈，為九個小晶片所組成的10W 高功率LED，利用MCPCB技術黏接在鋁基板上，搭配一個鋁散熱塊，基底為陶瓷材質的散熱座。針對晶片接面處溫度(Junction Temperature)作探討，利用ICEPAK分析軟體進行數值模擬，並針對陶瓷散熱座加以改良其形狀，觀察在不同情形下的溫度變化，最後目的希望達到晶片接面處溫度在安全溫度125℃以下。 研究結果顯示分析結果與實驗值誤差在5%左右，可得數值模擬在此分析上的可行性與可靠性。在形狀與材質的改變下發現，雖然溫度有降低情形，但並非為主要影響晶片溫度的主因，而在改變銀膠材質後發現晶片與基板接合處的銀膠才是最主要影響晶片接面溫度的原因，會直接關係到晶片上的溫度是否良好傳達到基板而影響到整體嵌燈的壽命，因此好的銀膠材質對高功率LED嵌燈是非常重要的一個因素。本文最佳化設計已將晶片接面溫度降至125℃以下，可供作為往後改良之參考依據。
並列摘要
A numerical research by computational fluid dynamic (CFD) software was performed to investigate the high-power light-emitting diodes (LED) module; furthermore, the research developed an efficient heat dissipation module with an acceptable range of error based on the experimental results. The high-power light-emitting diodes module was composed with nine chips in ten watt which were pasted in an aluminum (Al) substrate by MCPCB technique. A heat slug in Al and Ceramic were set under the substrate. Focusing on the junction temperature, this research performed a variety of numerical simulations by CFD software, ICEPAK, and improved the performance by changing the shape of the ceramic and observing the temperature change. The main purpose is to cool down the junction temperature under 125℃, which was refer to a secure temperature. The results showed that the error range was 5% between the simulation and the experiment. It presented that the numerical simulation was feasible and accurate. Although the temperature was cooled down in a change in shape, but, however, it was not a major effect on the junction temperature. In fact, the silver glue between the chip and the substrate actually plays an important role to affect the junction temperature. It is crucial for the heat be well-conducted from the chip to the substrate, and further, influents the life of the lamp. In this thesis, an optimum module which cooled down the junction temperature efficiently under 125℃ was developed, and could be a reference for improving an efficient LED lamp heat dissipation module in the future.