錫銅鎳銲料之性質研究

The Study of SnCuNi Solder

吳文寬(Wen-Kuang Wu)

指導教授 ： 鄭俊麟

中原大學/工學院/化學工程研究所/碩士(2009年)

https://doi.org/10.6840/cycu200901207

摘要

本研究之主要目的是以低成本之錫銅系列合金為基材，藉由鎳金屬的添加，製備出新的錫銅鎳系列無鉛合金，希望藉此新系列鉛銲料合金，可以保有原有錫銅合金低成本的特性，同時亦可以改善錫銅或錫銀銅系列合金所具有之銲接缺點。
我們調配不同比例之新錫銅鎳系列合金(Sn-0.7Cu-0.01Ni、Sn-0.7Cu-
0.1Ni、Sn-0.7Cu-0.5Ni及Sn-0.7Cu-1.0Ni)，與目前產業界普遍使用之Sn-
3.0Ag-0.5Cu、Sn-0.7Cu無鉛銲接材料，進行銲錫特性比對，藉由相關物理性質的比對，找尋最佳比例的錫銅鎳系列合金。
在本研究我們亦以熱流式熱示掃描卡量計，量測各種成份/比例合金之熔點；以可程式溫/濕控環境試驗機，測試各種合金之降伏強度；以推拉力試驗機，測試各種合金銲點強度；以切片作業搭配掃描式電子顯微鏡，量測沾錫角度及沾錫高度；再以光學顯微鏡，觀察金相組織。藉由這些物理性質的量測，得知Sn-0.7Cu-0.1Ni合金之銲錫特性為最佳，並且不再具有錫銅或錫銀銅系列合金之缺點，其價格亦相對便宜，非常適合作為無鉛波銲製程之銲接材料使用。
最後我們亦以Sn-0.7Cu-0.1Ni合金作為波銲製程之銲接材料，依據一般業界之測試條件進行可靠度試驗及產品壽命評估，並且亦搭配切片分析及金相組織觀察。測試結果顯示，以Sn-0.7Cu-0.1Ni合金為銲料之電子產品，其可靠度試驗及產品壽命均可符合一般業界對電子產品之規格要求。

關鍵字

錫銅鎳銲料之性質研究 ； 無鉛焊料

並列摘要

In this research, the main purpose is using the low cost of Sn-Cu alloy as sills, adding few nickels to prepare the new Sn-Cu-Ni alloys as lead-free solders. To prepare these new lead-free solders in hopes of keeping the low price and improving imperfection characteristic of Sn-Cu、Sn-Ag-Cu solder at the same time.
We produce the new prescription of Sn-Cu-Ni alloys with different proportions ( Sn-0.7Cu-0.01Ni、Sn-0.7Cu-0.1Ni、Sn-0.7Cu-0.5Ni & Sn-0.7Cu-1.0Ni) and compare the physical property with Sn-3.0Ag-0.5Cu、Sn-0.7Cu. Base on the physical property comparison, we want to find out the suitable / best composition of Sn-Cu-Ni lead-free solder.
We use the Jade DSC to test the melting、chamber to test the creep strength、push/pull test machine to test the bounding strength、cross section& SEM to measure the wetting angle and solder fill rate、optical microscope to check the micro-structure and crystal organization for each alloys. Than right by data of above physical properties, we find that soldering characteristic of Sn-0.7Cu-0.1Ni alloy is the best alloy for solder material. Sn-0.7Cu-0.1Ni alloy no longer have shortcoming as Sn-Cu and Sn-Ag-Cu alloys, and also got low price without expensive metal (Au、Ag..etc). Sn-0.7Cu-0.1Ni alloy/solder shall be suitable and best choice.
As the physical property comparison result, we take Sn-0.7Cu-0.1Ni alloy/solder for wave solder process to produce enough lead-free samples. Then, we test the Sn-0.7Cu-0.1Ni samples in the reliability experimental condition of the general industry. We take the samples to do the reliability test、life-test and also combine with cross section analysis and crystal organization checking. The result of the test shows, as the electronic products with Sn-0.7Cu-0.1Ni solders can meet the reliability and life-time requests of the specification for the general industry.

並列關鍵字

The Study of SnCuNi Solder ； Lead Free Solder

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