比較有鉛銲錫與無鉛銲錫在表面黏著技術之應用

Comparison of Lead Solder and Lead-Free Solder on the Application of Surface Mounting Technology

李泳泰(Yung-Tai Lee)

指導教授 ： 黃悉雅

中原大學/理學院/化學研究所/碩士(2005年)

https://doi.org/10.6840/cycu200500019

摘要

由於傳統銲錫63Sn-37Pb合金含有63wt%Sn-37wt%Pb，也由於鉛的成分會造成環境的污染與危害，所以，無鉛銲錫的研究與發展，正是目前各國努力的目標，而本研究在探討Sn-3.0wt%Ag-0.5wt%Cu四種無鉛銲錫與63wt%Sn-37wt%Pb有鉛銲錫在表面黏著技術之應用，並分別比較無鉛與有鉛銲錫之可銲性、潤濕性、擴散性、熱疲勞、冷熱衝擊性的不同，並透過掃描式電子顯微鏡(SEM)觀察銲錫表面的形態差異。
從實驗結果顯示，使用錫球陣列矩陣BGA(Ball Grid Array)重新植球的方式，在可銲性的部分：63wt%Sn-37wt%Pb有鉛銲錫的錫球聚合效果完整，而部分Sn-3.0wt%Ag-0.5wt%Cu無鉛銲錫的錫球會產生游離，甚至錫球與錫球間會產生聚集成一團的短路現象。在潤濕性部分：透過潤濕天平(Wetting Balance)之曲線可看出，63wt%Sn-37wt%Pb有鉛銲錫的平均潤濕時間在1.26sec效果最好，其餘Sn-3.0wt%Ag-0.5wt%Cu無鉛銲錫的平均潤濕時間界在3 ~ 5sec左右。在擴散性部分：63wt%Sn-37wt%Pb有鉛銲錫的平均擴散率在90.03%效果最好，其餘Sn-3.0wt%Ag-0.5wt%Cu無鉛銲錫的平均擴散率在76 ~ 80%。在冷熱衝擊性部分：由SEM觀察出，有鉛與無鉛錫球表面，經過不同冷熱條件下，並無明顯變化產生。在熱疲勞性部分：透過SEM的觀察，在不斷重複經過迴銲爐的IC引腳上的銲點變化，63wt%Sn-37wt%Pb有鉛銲錫在第1次迴銲後相較於10、20、30次的金屬表面屬於較完整，但分別在過10、20、30次後，銲點表面的金屬一一產生崩裂，另外，Sn-3.0wt%Ag-0.5wt%Cu無鉛銲錫部分，在不斷經過迴銲爐分別10、20、30次後，銲點表面的金屬，卻仍有部分表面結晶保持相當完整的情況。

關鍵字

表面黏著技術 ； 無鉛銲錫 ； 有鉛銲錫

並列摘要

The traditional solders of 63wt%Sn-37wt%Pb which contains a high level of Pb, were widely applied on Surface Mounting Technology due to many excellent characteristics. However, many reports has been demonstrated that many electronic products contained Lead solders may causes an environmental pollution problems, thus the Lead-Free solders were rapidly developed in recent years.
In order to compare the properties between commercial Lead-Free solders and traditional solders on the application of Surface Mounting Technology, several factors including solderability, wettability, spreadability, cold, hot shockability and thermal fatigue properties were examined.
In the study, the experiments and measurement were completed based on a Ball Grid Array (BGA) planted solder balls processes. The results of solderability indicated that the 63wt%Sn-37wt%Pb solder balls were still perfect, but the Lead-Free solder balls (Sn-3.0wt%Ag-0.5wt%Cu) were drifted, and even had short phenomenons after the solderability test. The wettability and spreadability tests shown that the 63wt%Sn-37wt%Pb solder had a shorter average wetting time and a wider average spreading ratio than other Lead-Free solders 3~5Sec, thus the traditional solder has a better wettability and spreadability. SEM observation indicated that both 63wt%Sn-37wt%Pb solder and Lead-Free solders had no a morphological change after a cold, hot shockability tests. Integrated Circuit (IC) pins solder joints still were completed for Lead-Free solders after 10~30 times thermal fatigue test, however the IC pins solder joints were almost broken only 10 times thermal fatigue test for the traditional solder, 63wt%Sn-37wt%Pb.

並列關鍵字

Lead-Free ； Surface mounting Technology ； Lead

參考文獻

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