本研究以不同的富勒烯材料(碳六十與奈米碳球)作為改質劑之一,再加上天然黏土做為分散載體及補強材,期望利用黏土的結晶水與氫氧基受熱脫水,來降低熱的傳導,與其片狀結構阻隔外來的氧氣及碳六十與奈米碳球豐富的雙鍵在燃燒時產生自由基可以捕捉高分子熱裂解產生的自由基,以期達到参重難燃的效果。在本研究中,將不同的碳簇材料(碳六十與奈米碳球)與天然黏土及其他的有機分子進行改質後,利用廣角X光繞射儀(WXRD)、熱重分析儀(TGA)及紅外線光譜儀(FT-IR)了解改質後與改質前黏土的層間距變化,以及改質劑進入黏土層間的所佔的比例。接著,將改質後黏土與酚醛環氧樹脂反應製成奈米複合材料,再藉由廣角X光繞射儀(WXRD)、穿透式電子顯微鏡(TEM)來了解黏土於酚醛環氧樹脂的分散型態,並利用熱重分析儀(TGA)、動態機械分析儀(DMA)來了解奈米複合材料的熱裂解溫度(Td)及複材的玻璃轉移溫度(Tg)。最後,利用極限氧指數儀(LOI)、圓錐量熱儀(Cone calorimeter)來測試複材的耐燃性,並將效果最好的組成配方實際應用在銅箔基板的製程,以及探討其各項基板性質及UL94之難燃性。另外,本實驗研究如何將黏土與電漿前趨液混合並在大氣電漿中反應形成薄膜,並探討成膜的可能性。結果發現,CL120_PI/C60-O/BEN 3wt%之複材其耐燃效果最佳,且製成之銅箔基板也通過UL94-V1之耐燃測試。在大氣電漿製程中,發現利用溶膠凝膠法可順利將黏土帶入大氣電漿中反應並沉積成薄膜。
In this study, clays, as dispersed template, were modified by different types of fullerene materials, such as carbon 60 and carbon nanocapsules as one of intercalants. The enhanced effects of fire retardant come from clays with barrier and fullerene with free radical capture. Clays were modified by organic compounds and functionalized C60 and carbon nanocapsules (CNC). The modified clays were characterized by wide-angle X-ray diffraction (WAXD), thermogravimetric analysis (TGA) and Fourier transform infrared spectroscopy (FT-IR) to confirm the inclusion of modified agent into clay layers. The dispersion morphology of clay in the novolac cured epoxy resin was analyzed by wide-angle X-ray diffraction (WXRD) and transmission electron microscopy (TEM). Thermo-gravimetric analysis (TGA) and dynamic mechanical analysis (DMA) were used to study the thermal and mechanical properties. Finally, limiting oxygen index (LOI) and cone calorimeter test were applied to evaluate the flammability of these nanocomposites. The best composition of modified clay nanocomposite was selected to make printed circuit board (PCB) and discussed the properties and flammability. Furthermore, the slurry, containing the modified clay as the precursor of plasma, was deposited on the surface of the substance and formed the film by the technology of the atmospheric-pressure plasma (AP plasma). Then study its characteristic. CL120_PI/C60-O/BEN 3wt% nanocomposite has shown the best flammability. Apply this result to make the printed circuit board which has passed the UL94-V1 test. The modified clays could be deposited on the surface of the substance and formed the film by the process of the atmospheric-pressure plasma (AP plasma).