異方向性導電膜於外引腳接合製程及熱-濕-機械行為之研究

A Study for Bonding Process and thermal-Moist-Mechanical Behaviors of Anisotropic Conductive Film on the Outer Lead Bonding

彭淑惠(Shu-Hui Peng)

指導教授 ： 鍾文仁

中原大學/工學院/機械工程研究所/博士(2010年)

https://doi.org/10.6840/CYCU.2010.00574

摘要

異方向性導電膜，有易於加工、符合微小間距及多腳數之高密度構裝的優點，因此廣泛應用於液晶顯示器。由於舊型異方向性導電膜的製程需要高溫、高壓及長時間，故本研究對一具有短時間反應、低接合壓力的新型異方向性導電膜材料之應用作為研究對象。分別藉由實驗及數值分析軟體(ANSYS)在製程規範下，了解此材料在熱傳、機械、電性、黏結強度表現，並模擬此材料對溫度循環、剝離測試及濕度測試的可靠度評估。
結果顯示，此款短反應接合時間之材料有良好的溫度反應率、流動特性、電性、黏著強度，導電粒子變形與壓痕；儘管有少許的膨脹效應但不影響內部元件。利用田口方法，發現內側導電粒子除了主要承受外部負載外，亦受膠材向外擠壓而變形，且接合壓力為最重要參數之一。在可靠度評估部份，則發現異方向性導電膜與玻璃基板間，為最先剝離處並沿著氧化銦錫物薄膜分佈發展，且膠材易受溫度及濕度變化而對內部元件造成破壞。最後將此材料應用到驅動晶片，發現在溫度循環下，改變膠材及凸塊高度有些許改善應力集中現象。

關鍵字

異方向性導電膜 ； 田口方法 ； 剝離測試 ； 溫度循環 ； 濕度測試

並列摘要

The advantages of anisotropic conductive film adhering to the electronic component include the process easily, more mounting counts, and fine pitch’s high density packages so that it is wildly applied to the liquid crystal display. However, the manufacturing process of conventional-type ACF requires more pressure, higher temperature and longer time to melt the resin matrixes. This study investigates the new-type ACF which offers the lower bonding temperature and the reduced curing time. The experiment and finite element software (ANSYS) are used to understand the characteristics of the new-type ACF on the thermal, mechanical, electrical and adhesive behaviors within the criteria of the bonding specification. Also, the reliability of the new-type ACF is investigated under the thermal cyclic loading, peel test and moist test respectively.
The results of curing degree, flow, contact resistance, adhesive strength and both deformed and trapped of conductive particles are properly for its application under the short reacting time. The resin matrixes has a little bit swelling behavior but it is not enough to break apart from all the components. Under Taguchi method, the inner conductive particle is subjected and deformed by both the external loading force and the extended force from the resin matrixes, and the bonding pressure is the most significant parameter. The delamination occurs at the interface between the resin matrixes and the glass substrate under the peel loading and then grows along the indium tin oxide. Also, the resin matrixes is easily affected by the temperature and moisture to damage the other components. Finally, this new-type ACF is applied to the drive chip and it is found that both bump height and resin matrixes thickness can be useful to improve the phenomenon of the stress concentration under the thermal cyclic loading.

並列關鍵字

Anisotropic Conductive Film ； Taguchi Method ； Thermal Cyclic Loading ； Peel Test ； Moist Test

參考文獻

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